A modified modular multilevel converter with reduced capacitor voltage fluctuation B Li, Y Zhang, G Wang, W Sun, D Xu, W Wang IEEE Transactions on Industrial Electronics 62 (10), 6108-6119, 2015 | 93 | 2015 |
Closed-loop precharge control of modular multilevel converters during start-up processes B Li, D Xu, Y Zhang, R Yang, G Wang, W Wang, D Xu IEEE Transactions on Power Electronics 30 (2), 524-531, 2014 | 87 | 2014 |
Seamless transition control for modular multilevel converters when inserting a cold-reserve redundant submodule B Li, Y Zhang, R Yang, R Xu, D Xu, W Wang IEEE Transactions on Power Electronics 30 (8), 4052-4057, 2015 | 83 | 2015 |
Simplified thermal modeling for IGBT modules with periodic power loss profiles in modular multilevel converters Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg IEEE Transactions on Industrial Electronics 66 (3), 2323-2332, 2018 | 80 | 2018 |
Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4202-4207, 2017 | 55 | 2017 |
Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters Y Zhang, H Wang, Z Wang, F Blaabjerg, M Saeedifard IEEE Transactions on Power Electronics, 2019 | 40 | 2019 |
Condition Monitoring Method for Submodule Capacitor in Modular Multilevel Converter H Wang, H Wang, Y Zhang, Z Wang, X Pei, Y Kang 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 344-348, 2019 | 32* | 2019 |
Condition monitoring for submodule capacitors in modular multilevel converters H Wang, H Wang, Z Wang, Y Zhang, X Pei, Y Kang IEEE Transactions on Power Electronics 34 (11), 10403-10407, 2019 | 30 | 2019 |
Artificial intelligence-aided thermal model considering cross-coupling effects Y Zhang, Z Wang, H Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (10), 9998-10002, 2020 | 25 | 2020 |
The impact of mission profile models on the predicted lifetime of IGBT modules in the modular multilevel converter Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg IECON 2017-43rd Annual Conference of the IEEE Industrial Electronics Society …, 2017 | 24 | 2017 |
Capacitor condition monitoring based on the DC-side start-up of modular multilevel converters Z Wang, Y Zhang, H Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (6), 5589-5593, 2019 | 21 | 2019 |
A viable mission profile emulator for power modules in modular multilevel converters Z Wang, H Wang, Y Zhang, F Blaabjerg IEEE Transactions on Power Electronics 34 (12), 11580-11593, 2019 | 20 | 2019 |
A reference submodule based capacitor condition monitoring method for modular multilevel converters Z Wang, Y Zhang, H Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (7), 6691-6696, 2019 | 16 | 2019 |
Simplified multi-time scale thermal model considering thermal coupling in IGBT modules Y Zhang, H Wang, Z Wang, F Blaabjerg 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 319-324, 2019 | 15 | 2019 |
An IGBT open-circuit fault detection method for modular multilevel converters B Li, Y Zhang, R Yang, G Wang, D Xu 2015 9th International Conference on Power Electronics and ECCE Asia (ICPE …, 2015 | 15 | 2015 |
Parameter estimation of batteries in MMCs with parallel connectivity using PSO B Arabsalmanabadi, N Tashakor, Y Zhang, K Al-Haddad, S Goetz IECON 2021–47th Annual Conference of the IEEE Industrial Electronics Society …, 2021 | 14 | 2021 |
Balanced conduction loss distribution among sms in modular multilevel converters Z Wang, H Wang, Y Zhang, F Blaabjerg 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia …, 2018 | 13 | 2018 |
Start-up control with constant precharge current for the modular multilevel converter B Li, Y Zhang, D Xu, R Yang 2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE), 673-676, 2014 | 13 | 2014 |
Computational-efficient thermal estimation for IGBT modules under periodic power loss profiles in modular multilevel converters Y Zhang, H Wang, Z Wang, F Blaabjerg IEEE Transactions on Industry Applications 55 (5), 4984-4992, 2019 | 11 | 2019 |
A simplification method for power device thermal modeling with quantitative error analysis Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019 | 11 | 2019 |