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Co-authors
Syed A. JafarChancellor's Professor of EECS, University of California IrvineVerified email at uci.edu
Chenwei WangPrincipal Research Engineer, DOCOMO Innovations Inc., Palo Alto, CaliforniaVerified email at uci.edu
Ahmet Hamdi KayranVerified email at itu.edu.tr
Sae-Young ChungProfessor of Electrical Engineering, KAISTVerified email at kaist.ac.kr
Sang-Woon JeonAssociate Professor of Military Information Engineering, Hanyang UniversityVerified email at hanyang.ac.kr
Hua SunAssistant Professor of EE, University of North TexasVerified email at unt.edu
Toshiaki Koike-AkinoMERLVerified email at merl.com
Chunhua Geng (耿春华)MediaTek USA Inc., Bell Labs, UC Irvine, Tsinghua UniversityVerified email at mediatek.com
Claudio R. C. M. da SilvaIntel CorpVerified email at ieee.org
Philip OrlikResearcher at Mitsubishi Electric Research LabsVerified email at merl.com
Jungwon LeeVice President, Samsung US R&DVerified email at samsung.com
Man On PunThe Chinese University of Hong Kong (Shenzhen)Verified email at alumni.usc.edu
