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Quan PanSouthern University of Science and TechnologyVerified email at sustech.edu.cn
Wing-Hung KiThe Hong Kong University of Science and TechnologyVerified email at ust.hk
Yan LuProfessor, Tsinghua UniversityVerified email at tsinghua.edu.cn
Salahuddin RajuScientist, Senior Member of IEEEVerified email at ieee.org
Liang WuThe Chinese University of Hong Kong, ShenzhenVerified email at ieee.org
Mansun ChanChair Professor, HKUSTVerified email at ust.hk
Frank O'MahonyIntelVerified email at intel.com
Kei May LauHong Kong University of Science & TechnologyVerified email at ust.hk
Rongxiang WUAssociate Professor of Microelectronics and Solid-State Electronics, UESTCVerified email at uestc.edu.cn
Mark HorowitzProfessor of Electrical Engineering and Computer ScienceVerified email at ee.stanford.edu
Piljae ParkETRIVerified email at etri.re.kr
H. Tom SohProfessor of Electrical Engineering and Radiology, Stanford UniversityVerified email at stanford.edu
Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
Li SunPrincipal Engineer at MarvellVerified email at marvell.com
Patrick ChiangProfessor of Electrical and Computer Engineering, Fudan UniversityVerified email at fudan.edu.cn
Zongyu DongQualcomm Technology IncVerified email at ucr.edu
Upamanyu MadhowProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
James A. BainProfessor of ECE, Carnegie Mellon UniversityVerified email at ece.cmu.edu
Chi Ying TsuiHong Kong University of Science and TechnologyVerified email at ece.ust.hk
Philip K.T. Mok, IEEE FellowProfessor Emeritus of Dept of ECE, Hong Kong University of ScienceVerified email at ust.hk