Peter Debacker
Peter Debacker
Principal Member of Technical Staff, imec
Verified email at
Cited by
Cited by
Understanding Energy Efficiency Benefits of Carbon Nanotube Field-Effect Transistors for Digital VLSI
G Hills, MG Bardon, G Doornbos, D Yakimets, P Schuddinck, R Baert, ...
IEEE Transactions on Nanotechnology 17 (6), 1259-1269, 2018
Extreme scaling enabled by 5 tracks cells: holistic design-device co-optimization for FinFETs and lateral nanowires
M Garcia Bardon, Y Sherazi, P Schuddinck, D Jang, D Yakimets, ...
IEEE International Electron Devices Meeting-IEDM, 687-690, 2016
Dynamic time-slot allocation for QoS enabled networks on chip
T Marescaux, B Bricke, P Debacker, V Nollet, H Corporaal
3rd Workshop on Embedded Systems for Real-Time Multimedia, 2005., 47-52, 2005
Standard cell design in N7: EUV vs. immersion
B Chava, D Rio, Y Sherazi, D Trivkovic, W Gillijns, P Debacker, ...
Design-Process-Technology Co-optimization for Manufacturability IX 9427, 110-118, 2015
The impact of sequential-3D integration on semiconductor scaling roadmap
A Mallik, A Vandooren, L Witters, A Walke, J Franco, Y Sherazi, P Weckx, ...
2017 IEEE International Electron Devices Meeting (IEDM), 32.1. 1-31.1. 4, 2017
Towards 10000TOPS/W DNN Inference with Analog in-Memory Computing–A Circuit Blueprint, Device Options and Requirements
S Cosemans, B Verhoef, J Doevenspeck, IA Papistas, F Catthoor, ...
2019 IEEE International Electron Devices Meeting (IEDM), 22.2. 1-22.2. 4, 2019
Technology/system codesign and benchmarking for lateral and vertical GAA nanowire FETs at 5-nm technology node
C Pan, P Raghavan, D Yakimets, P Debacker, F Catthoor, N Collaert, ...
IEEE Transactions on Electron Devices 62 (10), 3125-3132, 2015
Design-technology co-optimization for OxRRAM-based synaptic processing unit
A Mallik, D Garbin, A Fantini, D Rodopoulos, R Degraeve, J Stuijt, AK Das, ...
2017 Symposium on VLSI Technology, T178-T179, 2017
Low track height standard cell design in iN7 using scaling boosters
SMY Sherazi, C Jha, D Rodopoulos, P Debacker, B Chava, L Matti, ...
Design-Process-Technology Co-optimization for Manufacturability XI 10148 …, 2017
SOT-MRAM based analog in-memory computing for DNN inference
J Doevenspeck, K Garello, B Verhoef, R Degraeve, S Van Beek, D Crotti, ...
2020 IEEE Symposium on VLSI Technology, 1-2, 2020
Buried Power Rails and Back-side Power Grids: Arm® CPU Power Delivery Network Design Beyond 5nm
D Prasad, SST Nibhanupudi, S Das, O Zografos, B Chehab, S Sarkar, ...
2019 IEEE International Electron Devices Meeting (IEDM), 19.1. 1-19.1. 4, 2019
An area and energy efficient half-row-paralleled layer LDPC decoder for the 802.11 AD standard
M Li, F Naessens, P Debacker, P Raghavan, C Desset, M Li, A Dejonghe, ...
SiPS 2013 Proceedings, 112-117, 2013
Standard-cell design architecture options below 5nm node: The ultimate scaling of FinFET and Nanosheet
SMY Sherazi, M Cupak, P Weckx, O Zografos, D Jang, P Debacker, ...
Design-Process-Technology Co-optimization for Manufacturability XIII 10962 …, 2019
Architectural strategies in standard-cell design for the 7 nm and beyond technology node
SMY Sherazi, B Chava, P Debacker, MG Bardon, P Schuddinck, F Firouzi, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (1), 013507, 2016
DTCO exploration for efficient standard cell power rails
B Chava, J Ryckaert, L Mattii, SMY Sherazi, P Debacker, A Spessot, ...
Design-Process-Technology Co-optimization for Manufacturability XII 10588, 89-94, 2018
Integrated circuit power distribution network
P Debacker, P Raghavan, VC Gerousis
US Patent 10,510,774, 2019
Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs
BW Ku, P Debacker, D Milojevic, P Raghavan, D Verkest, A Thean, ...
Proceedings of the 2016 International Symposium on Low Power Electronics and …, 2016
Neural network accelerator comparison
K Guo, W Li, K Zhong, Z Zhu, S Zeng, S Han, Y Xie, P Debacker, ...
NICS Lab of Tsinghua University. http://nicsefc. ee. tsinghua. edu. cn …, 2020
An energy efficient 18Gbps LDPC decoding processor for 802.11 ad in 28nm CMOS
M Li, JW Weijers, V Derudder, I Vos, M Rykunov, S Dupont, P Debacker, ...
2015 IEEE Asian Solid-State Circuits Conference (A-SSCC), 1-5, 2015
A 22 nm, 1540 TOP/s/W, 12.1 TOP/s/mm2 in-Memory Analog Matrix-Vector-Multiplier for DNN Acceleration
IA Papistas, S Cosemans, B Rooseleer, J Doevenspeck, MH Na, A Mallik, ...
2021 IEEE Custom Integrated Circuits Conference (CICC), 1-2, 2021
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