| Reliability prediction with MTOL JB Bernstein, A Bensoussan, E Bender Microelectronics Reliability 68, 91-97, 2017 | 26 | 2017 |
| Simplified algorithm for assessment equivalent circuit parameters of induction motors S Rajput, E Bender, M Averbukh IET Electric power applications 14 (3), 426-432, 2020 | 24 | 2020 |
| Reliability prediction of FinFET FPGAs by MTOL E Bender, JB Bernstein, A Bensoussan Microelectronics Reliability 114, 113809, 2020 | 12 | 2020 |
| Microchip Health Monitoring System Using the FLL Circuit E Bender, JB Bernstein Sensors 21 (7), 2285, 2021 | 3 | 2021 |
| The Correct Hot Carrier Degradation Model JB Bernstein, E Bender, A Bensoussan 2023 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2023 | 2 | 2023 |
| Reliability Prediction for Microelectronics JB Bernstein, A Bensoussan, E Bender John Wiley & Sons, 2024 | 1 | 2024 |
| Identification of Multiple Failure Mechanisms for Device Reliability using Differential Evolution U Chakraborty, E Bender, DS Boning, CV Thompson IEEE Transactions on Device and Materials Reliability, 2023 | 1 | 2023 |
| Self-Heating Effects Measured in Fully Packaged FinFET Devices E Bender, JB Bernstein 2021 IEEE 32nd International Conference on Microelectronics (MIEL), 65-68, 2021 | 1 | 2021 |
| Modern Trends in Microelectronics Packaging Reliability Testing E Bender, JB Bernstein, DS Boning Micromachines 15 (3), 398, 2024 | | 2024 |
| The Effects of Process Variations and BTI in Packaged FinFET Devices E Bender, JB Bernstein, DS Boning 2023 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2023 | | 2023 |
| Mitigation of Thermal Stability Concerns in FinFET Devices E Bender, JB Bernstein, DS Boning Electronics 11 (20), 3305, 2022 | | 2022 |
Joseph BernsteinAriel UniversityVerified email at ariel.ac.il
