Pre-Clean Of Silicon Germanium For Pre-Metal Contact At Source And Drain And Pre-High K At Channel B Zheng, J Gelatos, A Vyas, R Hung US Patent 20,160,079,062, 2016 | 96 | 2016 |
On-chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes AA Vyas, C Zhou, CY Yang IEEE Transactions on Nanotechnology, 2018 | 73 | 2018 |
Metal–nanocarbon contacts P Wilhite, AA Vyas, J Tan, J Tan, T Yamada, P Wang, J Park, CY Yang Semiconductor Science and Technology 29 (5), 054006, 2014 | 73 | 2014 |
Resistance determination for sub-100-nm carbon nanotube vias C Zhou, AA Vyas, P Wilhite, P Wang, M Chan, CY Yang IEEE Electron Device Letters 36 (1), 71-73, 2014 | 27 | 2014 |
Synthesis and interface characterization of CNTs on graphene C Zhou, R Senegor, Z Baron, Y Chen, S Raju, AA Vyas, M Chan, Y Chai, ... Nanotechnology 28 (5), 054007, 2016 | 23 | 2016 |
Electron-beam and ion-beam-induced deposited tungsten contacts for carbon nanofiber interconnects P Wilhite, HS Uh, N Kanzaki, P Wang, A Vyas, S Maeda, T Yamada, ... Nanotechnology 25 (37), 375702, 2014 | 15 | 2014 |
Electrical properties of carbon nanotube via interconnects for 30nm linewidth and beyond AA Vyas, C Zhou, P Wilhite, P Wang, CY Yang Microelectronics Reliability, 2015 | 13 | 2015 |
PMOS contact resistance solution compatible to CMOS integration for 7 nm node and beyond CN Ni, YC Huang, S Jun, S Sun, A Vyas, F Khaja, KV Rao, S Sharma, ... 2016 International Symposium on VLSI Technology, Systems and Application …, 2016 | 11 | 2016 |
Effect of improved contact on reliability of sub-60 nm carbon nanotube vias AA Vyas, C Zhou, Y Chai, P Wang, CY Yang Nanotechnology 27 (37), 375202, 2016 | 8 | 2016 |
Carbon Nanofiber Interconnect RF Characteristics Improvement with Deposited Tungsten Contacts AA Vyas, F Madriz, N Kanzaki, P Wilhite, X Sun, T Yamada, CY Yang Journal of Nanoscience and Nanotechnology 14 (3), 2683-2686(4), 2014 | 7 | 2014 |
Metal-CNT contacts P Wilhite, AA Vyas, CY Yang 2014 12th IEEE International Conference on Solid-State and Integrated …, 2014 | 5 | 2014 |
Electrical and Structural Analysis of CNT-Metal Contacts in Via Interconnects P Wilhite, A Vyas, J Tan, CY Yang, P Wang, J Park, H Ai, M Narasimhan | 4 | 2013 |
Carbon Nanotube Interconnects for End-of-Roadmap Semiconductor Technology Nodes AA Vyas Santa Clara University, 2016 | 3 | 2016 |
Pre-clean of silicon germanium for pre-metal contact at source and drain and pre-high k at channel B Zheng, AV Gelatos, V Anshul, RH Hung US Patent 10,163,630, 2018 | 2 | 2018 |
Contact resistance and reliability of 40 nm carbon nanotube vias AA Vyas, CY Yang, P Wang, C Zhou, Y Chai 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 2 | 2016 |
Conductive contact area estimation for carbon nanotube via interconnects using secondary-electron imaging Y Abe, M Suzuki, A Vyas, CY Yang Journal of Applied Physics 123 (2), 2018 | 1 | 2018 |
Nanocarbon via interconnects AA Vyas, C Zhou, P Wilhite, P Wang, CY Yang 2016 IEEE International Conference on Electron Devices and Solid-State …, 2016 | 1 | 2016 |
Contact engineering for nanocarbon interconnects Y Abe, A Vyas, R Senegor, P Wilhite, C Yang 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), 1194-1196, 2015 | 1 | 2015 |
High-frequency behavior of one-dimensional nanocarbons AA Vyas, F Madriz, N Kanzaki, P Wilhite, X Sun, CY Yang 2012 IEEE 11th International Conference on Solid-State and Integrated …, 2012 | 1 | 2012 |
Bayesian Decomposition For Mismatched Performances In Semiconductor Equipment L Ferryanto, B Wang, R Edupuganti, AA Vyas US Patent App. 17/727,792, 2023 | | 2023 |