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Anshul Vyas
Anshul Vyas
Unknown affiliation
Verified email at scu.edu
Title
Cited by
Cited by
Year
Pre-Clean Of Silicon Germanium For Pre-Metal Contact At Source And Drain And Pre-High K At Channel
B Zheng, J Gelatos, A Vyas, R Hung
US Patent 20,160,079,062, 2016
962016
On-chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes
AA Vyas, C Zhou, CY Yang
IEEE Transactions on Nanotechnology, 2018
732018
Metal–nanocarbon contacts
P Wilhite, AA Vyas, J Tan, J Tan, T Yamada, P Wang, J Park, CY Yang
Semiconductor Science and Technology 29 (5), 054006, 2014
732014
Resistance determination for sub-100-nm carbon nanotube vias
C Zhou, AA Vyas, P Wilhite, P Wang, M Chan, CY Yang
IEEE Electron Device Letters 36 (1), 71-73, 2014
272014
Synthesis and interface characterization of CNTs on graphene
C Zhou, R Senegor, Z Baron, Y Chen, S Raju, AA Vyas, M Chan, Y Chai, ...
Nanotechnology 28 (5), 054007, 2016
232016
Electron-beam and ion-beam-induced deposited tungsten contacts for carbon nanofiber interconnects
P Wilhite, HS Uh, N Kanzaki, P Wang, A Vyas, S Maeda, T Yamada, ...
Nanotechnology 25 (37), 375702, 2014
152014
Electrical properties of carbon nanotube via interconnects for 30nm linewidth and beyond
AA Vyas, C Zhou, P Wilhite, P Wang, CY Yang
Microelectronics Reliability, 2015
132015
PMOS contact resistance solution compatible to CMOS integration for 7 nm node and beyond
CN Ni, YC Huang, S Jun, S Sun, A Vyas, F Khaja, KV Rao, S Sharma, ...
2016 International Symposium on VLSI Technology, Systems and Application …, 2016
112016
Effect of improved contact on reliability of sub-60 nm carbon nanotube vias
AA Vyas, C Zhou, Y Chai, P Wang, CY Yang
Nanotechnology 27 (37), 375202, 2016
82016
Carbon Nanofiber Interconnect RF Characteristics Improvement with Deposited Tungsten Contacts
AA Vyas, F Madriz, N Kanzaki, P Wilhite, X Sun, T Yamada, CY Yang
Journal of Nanoscience and Nanotechnology 14 (3), 2683-2686(4), 2014
72014
Metal-CNT contacts
P Wilhite, AA Vyas, CY Yang
2014 12th IEEE International Conference on Solid-State and Integrated …, 2014
52014
Electrical and Structural Analysis of CNT-Metal Contacts in Via Interconnects
P Wilhite, A Vyas, J Tan, CY Yang, P Wang, J Park, H Ai, M Narasimhan
42013
Carbon Nanotube Interconnects for End-of-Roadmap Semiconductor Technology Nodes
AA Vyas
Santa Clara University, 2016
32016
Pre-clean of silicon germanium for pre-metal contact at source and drain and pre-high k at channel
B Zheng, AV Gelatos, V Anshul, RH Hung
US Patent 10,163,630, 2018
22018
Contact resistance and reliability of 40 nm carbon nanotube vias
AA Vyas, CY Yang, P Wang, C Zhou, Y Chai
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
22016
Conductive contact area estimation for carbon nanotube via interconnects using secondary-electron imaging
Y Abe, M Suzuki, A Vyas, CY Yang
Journal of Applied Physics 123 (2), 2018
12018
Nanocarbon via interconnects
AA Vyas, C Zhou, P Wilhite, P Wang, CY Yang
2016 IEEE International Conference on Electron Devices and Solid-State …, 2016
12016
Contact engineering for nanocarbon interconnects
Y Abe, A Vyas, R Senegor, P Wilhite, C Yang
2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), 1194-1196, 2015
12015
High-frequency behavior of one-dimensional nanocarbons
AA Vyas, F Madriz, N Kanzaki, P Wilhite, X Sun, CY Yang
2012 IEEE 11th International Conference on Solid-State and Integrated …, 2012
12012
Bayesian Decomposition For Mismatched Performances In Semiconductor Equipment
L Ferryanto, B Wang, R Edupuganti, AA Vyas
US Patent App. 17/727,792, 2023
2023
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