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Vahid  Samavatian
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A High Efficiency Input/Output Magnetically Coupled Interleaved Buck–Boost Converter With Low Internal Oscillation for Fuel-Cell Applications: CCM Steady-State Analysis
V Samavatian, A Radan
industrial Electronics, IEEE Transactions on 69 (9), 5560-5568, 2015
852015
A high efficiency input/output magnetically coupled interleaved buck–boost converter with low internal oscillation for fuel-cell applications: Small signal modeling and dynamic …
V Samavatian, A Radan
International Journal of Electrical Power & Energy Systems 67, 261-271, 2015
852015
A Novel Non-isolated Ultra-high Voltage Gain DC-DC Converter with low voltage stress
Y Cao, V Samavatian, K Kaskani, H Eshraghi
IEEE Transactions on Industrial Electronics 64 (4), 2809 - 2819, 2017
652017
Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics
V Samavatian, M Fotuhi-Firuzabad, M Samavatian, P Dehghanian, ...
Scientific reports 10 (1), 14821, 2020
542020
An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm
V Samavatian, H Iman-Eini, Y Avenas
International Journal of fatigue 116, 284-292, 2018
532018
A novel low-ripple interleaved buck–boost converter with high efficiency and low oscillation for fuel-cell applications
V Samavatian, A Radan
International Journal of Electrical Power & Energy Systems 63, 446-454, 2014
472014
Effects of system design on fatigue life of solder joints in BGA packages under vibration at random frequencies
M Samavatian, LK Ilyashenko, A Surendar, A Maseleno, V Samavatian
Journal of Electronic Materials 47, 6781-6790, 2018
452018
Effects of Creep Failure Mechanisms on Thermo-mechanical Reliability of Solder Joints in Power Semiconductors
V Samavatian, H Iman-Eini, Y Avenas, M Samavatian
IEEE Transactions on Power Electronics 35 (9), 8956 - 8964, 2020
432020
Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system
A Surendar, V Samavatian, A Maseleno, AZ Ibatova, M Samavatian
Journal of Materials Science: Materials in Electronics 29, 15249-15258, 2018
432018
Discovery of novel quaternary bulk metallic glasses using a developed correlation-based neural network approach
M Samavatian, R Gholamipour, V Samavatian
Computational Materials Science 186, 110025, 2021
392021
Effect of stress triaxiality on damage evolution of porous solder joints in IGBT Discretes
M Samavatian, V Samavatian, M Moayeri, H Babaei
Journal of Manufacturing Processes 32, 57-64, 2018
382018
Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module
D Ghaderi, M Pourmahdavi, V Samavatian, O Mir, M Samavatian
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2019
302019
Reliability Enhancement of a power semiconductor with optimized solder layer thickness
R Elakkiya, G Kavithaa, V Samavatian, K Alhaifi, A Kokabi, H Moayedi
IEEE Transactions on Power Electronics 35 (6), 6397 - 6404, 2020
282020
Effect of thermal cycle loadings on mechanical properties and thermal conductivity of a porous lead-free solder joint
A Surendar, LG Akhmetov, LK Ilyashenko, A Maseleno, V Samavatian
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018
242018
Effects of thermo-mechanical fatigue and low cycle fatigue interaction on performance of solder joints
A Surendar, KH Kishore, M Kavitha, AZ Ibatova, V Samavatian
IEEE Transactions on Device and Materials Reliability 18 (4), 606-612, 2018
232018
Effects of Nb minor addition on atomic structure and glass forming ability of Zr55Cu30Ni5Al10 bulk metallic glass
M Samavatian, R Gholamipour, V Samavatian, F Farahani
Materials Research Express 6 (6), 065202, 2019
212019
Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems
V Samavatian, H Imaneini, Y Avenas
IEEE Transactions on Power Electronics 35 (4), 4024 - 4032, 2020
202020
Influence of directional random vibration on the fatigue life of solder joints in a power module
V Samavatian, A Masoumian, M Mafi, M Lakzaei, D Ghaderi
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018
202018
Iterative machine learning-aided framework bridges between fatigue and creep damages in solder interconnections
V Samavatian, M Fotuhi-Firuzabad, M Samavatian, P Dehghanian, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021
192021
Inherent relation between atomic-level stresses and nanoscale heterogeneity in Zr-based bulk metallic glass under a rejuvenation process
M Samavatian, R Gholamipour, AA Amadeh, V Samavatian
Physica B: Condensed Matter 595, 412390, 2020
172020
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