| A digital twin based estimation method for health indicators of DC–DC converters Y Peng, S Zhao, H Wang IEEE Transactions on Power Electronics 36 (2), 2105-2118, 2020 | 156 | 2020 |
| Condition monitoring IGBT module bond wires fatigue using short-circuit current identification P Sun, C Gong, X Du, Y Peng, B Wang, L Zhou IEEE Transactions on Power Electronics 32 (5), 3777-3786, 2016 | 98 | 2016 |
| Parameter estimation of power electronic converters with physics-informed machine learning S Zhao, Y Peng, Y Zhang, H Wang IEEE Transactions on Power Electronics 37 (10), 11567-11578, 2022 | 38 | 2022 |
| Application of digital twin concept in condition monitoring for dc-dc converter Y Peng, H Wang 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 2199-2204, 2019 | 38 | 2019 |
| A simplified on-state voltage measurement circuit for power semiconductor devices Y Peng, H Wang IEEE Transactions on Power Electronics 36 (10), 10993-10997, 2021 | 33 | 2021 |
| Health state estimation and remaining useful life prediction of power devices subject to noisy and aperiodic condition monitoring S Zhao, Y Peng, F Yang, E Ugur, B Akin, H Wang IEEE Transactions on Instrumentation and Measurement 70, 1-16, 2021 | 33 | 2021 |
| Junction temperature estimation of IGBT module via a bond wires lift‐off independent parameter VgE‐np Y Peng, L Zhou, X Du, P Sun, K Wang, J Cai IET Power Electronics 11 (2), 320-328, 2018 | 24 | 2018 |
| A Converter-Level on-State Voltage Measurement Method for Power Semiconductor Devices Y Peng, Y Shen, H Wang IEEE Transactions on Power Electronics 36 (2), 1220-1224, 2020 | 22 | 2020 |
| A temperature-independent method for monitoring the degradation of bond wires in IGBT modules based on transfer characteristics Y Peng, P Sun, L Zhou, X Du, J Cai 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 751-755, 2017 | 22 | 2017 |
| Study of IGBT junction temperature estimation based on turn-on miller platform voltage Y Peng, L Zhou, P Sun, C Gong, X Du Proceedings of the CSEE 37 (11), 3254-3262, 2017 | 15 | 2017 |
| An on-line calibration method for TSEP-based junction temperature estimation Y Peng, Q Wang, H Wang, H Wang IEEE Transactions on Industrial Electronics 69 (12), 13616-13624, 2021 | 14 | 2021 |
| A Self-Power Method for a Converter-Level on-State Voltage Measurement Concept Y Peng, H Wang IEEE Transactions on Power Electronics 36 (8), 8743-8751, 2021 | 13 | 2021 |
| Study of IGBT module aging failure base on bond wire equivalent resistance Y Peng, LW Zhou, YM Zhang, PJ Sun, X Du State Key Laboratory of Power Transmission Equipment & System Security and …, 2017 | 11 | 2017 |
| Parasitic effect compensation method for IGBT on-state voltage measurement in traction inverter application Y Peng, K Chu, S Mu, H Cao, H Wang IEEE Transactions on Power Electronics 37 (5), 4937-4941, 2021 | 7 | 2021 |
| Thermal mapping of power semiconductors in H-bridge circuit D Zhou, Y Peng, F Iannuzzo, M Hartmann, F Blaabjerg Applied Sciences 10 (12), 4340, 2020 | 7 | 2020 |
| A condition monitoring method for three phase inverter based on system-level signal Y Peng, Y Shen, H Wang 2018 IEEE International Power Electronics and Application Conference and …, 2018 | 7 | 2018 |
| Duty Cycle based Condition Monitoring of MOSFETs in Digitally-Controlled DC-DC Converters Y Peng, H Wang 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), 364-369, 2020 | 6 | 2020 |
| Junction temperature estimation for IGBT modules through knee voltage X Wei, B Yao, Y Peng, H Wang 2022 International Power Electronics Conference (IPEC-Himeji 2022-ECCE Asia …, 2022 | 5 | 2022 |
| Parameters identification of buck converter based on dynamic characteristics Y Peng, H Wang 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE …, 2019 | 5 | 2019 |
| DC-link Capacitance Estimation based on Discharge Profile of Inverter for EV Application X Wei, Y Peng, B Yao, H Wang 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE …, 2023 | 4 | 2023 |
