Get my own profile
Public access
View all10 articles
4 articles
available
not available
Based on funding mandates
Co-authors
Guangyu SunSchool of Integrated Circuits, Peking UniversityVerified email at pku.edu.cn
Yuzhang ShangIllinois Institute of TechnologyVerified email at hawk.iit.edu
Bingzhe WuTencent AI LabVerified email at pku.edu.cn
Yan YanUniversity of Illinois ChicagoVerified email at uic.edu
Chenhao XueSchool of Integrated Circuits, Peking UniversityVerified email at pku.edu.cn
Yijin GuanVerified email at pku.edu.cn
Xinggang WangProfessor, Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Wenyu LiuThe University of SydneyVerified email at sydney.edu.au
Jingsheng Jason CongVolgenau Chair for Engineering Excellence, Computer Science and Electrical Engineering, UniversityVerified email at cs.ucla.edu
Dawei YangFudan UniversityVerified email at fudan.edu.cn
Sifan ZhouSoutheast UniversityVerified email at seu.edu.cn
Yiqi ChenPeking UniversityVerified email at pku.edu.cn
Guohao Dai(戴国浩)Associate Professor of Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Shengen YanDepartment of Electronic Engineering, Tsinghua University, ChinaVerified email at tsinghua.edu.cn
Yu Wang (汪玉)Department of Electronic Engineering, Tsinghua University, ChinaVerified email at mail.tsinghua.edu.cn
Zhen DongPhD & Postdoc at Berkeley AI ResearchVerified email at berkeley.edu
Zhe ZhouHuaweiVerified email at pku.edu.cn
Xiuhong LiPeking UniversityVerified email at pku.edu.cn
Xuefei NingTsinghua UniversityVerified email at mail.tsinghua.edu.cn
Yizeng HanAlibaba DAMO AcademyVerified email at alibaba-inc.com