| Proportional Hazard Model of doped low creep lead free solder paste under thermal shock A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 16 | 2016 |
| Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 14 | 2016 |
| Comparative Study on Impact Of Various Low Creep Doped Lead Free Solder Alloys A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, J Evans, ... SMTA International Proceedings, 820-826, 2017 | 12 | 2017 |
| The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages S Thirugnanasambandam, T Sanders, A Raj, D Stone, J Evans, G Flowers, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 11 | 2014 |
| Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing S Sridhar, A Raj, J Evans, M Bozack, W Johnson, S d Hamasha Proceedings of SMTA International, 562-567, 2017 | 10 | 2017 |
| Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ... Proceedings of SMTA International, 354-361, 2015 | 10 | 2015 |
| Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder with Semiparametric Estimation A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019 | 9 | 2019 |
| Proportional Hazard Model of doped low creep lead free solder paste under vibration S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 9 | 2016 |
| Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-Term Isothermal Aging S Gordon, S Thirugnanasambandam, T Sanders, A Raj, S Sridhar, ... Proceedings of SMTA International, 438-442, 2017 | 7 | 2017 |
| Long Term Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys A Raj, S Sridhar, S Gordon, J Evans, M Bozack, W Johnson Proceedings of SMTA International, 2018 | 6 | 2018 |
| Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 5 | 2019 |
| Reliability Testing of Isothermally Aged Doped Low Creep Lead-Free Solder Paste Alloys Under Vibration and Shock Conditions S Sridhar, S Thirugnanasambandam, S Gordon, A Raj, T Sanders, ... Proceedings of SMTA International, 432-437, 2016 | 1 | 2016 |
| Assembly Options and Challenges for Electronic Products With Lead-Free Exemption CM Huang, A Raj, M Osterman, M Pecht IEEE Access 8, 134194-134208, 2020 | | 2020 |
| Degradation of Leadfree Solder Materials Subjected to Isothermal Aging with Use of the CABGA208 Package S Gordon, T Sanders, A Raj, CJ Evans, T Devall, G Harris, JL Evans 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2020 | | 2020 |
| The Effects of Aging on Doped Lead-Free Solder under Thermal Shock and Thermal Cycling A Raj Auburn University, 2019 | | 2019 |
| Isothermal Aging Effects of Doped Lead-Free Solder Performance in Super BGA Package A Raj, S Thirugnanasambandam, J Evans Proceedings of International Conference for Electronics Enabling Technologies, 2018 | | 2018 |
