Anto Raj
Anto Raj
PhD, Industrial and Systems Engineering
Verified email at auburn.edu
Title
Cited by
Cited by
Year
Proportional Hazard Model of doped low creep lead free solder paste under thermal shock
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
152016
Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys
S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
142016
Comparative Study on Impact Of Various Low Creep Doped Lead Free Solder Alloys
A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, J Evans, ...
SMTA International Proceedings, 820-826, 2017
122017
The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages
S Thirugnanasambandam, T Sanders, A Raj, D Stone, J Evans, G Flowers, ...
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
112014
Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing
S Sridhar, A Raj, J Evans, M Bozack, W Johnson, S d Hamasha
Proceedings of SMTA International, 562-567, 2017
102017
Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ...
Proceedings of SMTA International, 354-361, 2015
102015
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder with Semiparametric Estimation
A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019
92019
Proportional Hazard Model of doped low creep lead free solder paste under vibration
S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
92016
Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-Term Isothermal Aging
S Gordon, S Thirugnanasambandam, T Sanders, A Raj, S Sridhar, ...
Proceedings of SMTA International, 438-442, 2017
72017
Long Term Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys
A Raj, S Sridhar, S Gordon, J Evans, M Bozack, W Johnson
Proceedings of SMTA International, 2018
62018
Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications
S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019
52019
Reliability Testing of Isothermally Aged Doped Low Creep Lead-Free Solder Paste Alloys Under Vibration and Shock Conditions
S Sridhar, S Thirugnanasambandam, S Gordon, A Raj, T Sanders, ...
Proceedings of SMTA International, 432-437, 2016
12016
Assembly Options and Challenges for Electronic Products With Lead-Free Exemption
CM Huang, A Raj, M Osterman, M Pecht
IEEE Access 8, 134194-134208, 2020
2020
Degradation of Leadfree Solder Materials Subjected to Isothermal Aging with Use of the CABGA208 Package
S Gordon, T Sanders, A Raj, CJ Evans, T Devall, G Harris, JL Evans
2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2020
2020
The Effects of Aging on Doped Lead-Free Solder under Thermal Shock and Thermal Cycling
A Raj
Auburn University, 2019
2019
Isothermal Aging Effects of Doped Lead-Free Solder Performance in Super BGA Package
A Raj, S Thirugnanasambandam, J Evans
Proceedings of International Conference for Electronics Enabling Technologies, 2018
2018
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