Fundamentals and applications of sonic technology DPR Thanu, M Zhao, Z Han, M Keswani Developments in Surface Contamination and Cleaning: Applications of Cleaning …, 2019 | 23 | 2019 |
Fundamentals and applications of plasma cleaning DPR Thanu, ES Srinadhu, M Zhao, NV Dole, M Keswani Developments in surface contamination and cleaning: applications of cleaning …, 2019 | 17 | 2019 |
The formation mechanism of gradient porous Si in a contactless electrochemical process M Zhao, A McCormack, M Keswani Journal of Materials Chemistry C 4 (19), 4204-4210, 2016 | 16 | 2016 |
Characterization of stable and transient cavitation in megasonically irradiated aqueous solutions R Balachandran, M Zhao, P Yam, C Zanelli, M Keswani Microelectronic Engineering 133, 45-50, 2015 | 14 | 2015 |
Role of ammonia and carbonates in scavenging hydroxyl radicals generated during megasonic irradiation of wafer cleaning solutions R Balachandran, M Zhao, B Dong, I Brown, S Raghavan, M Keswani Microelectronic engineering 130, 82-86, 2014 | 13 | 2014 |
Synthesis of porous silicon through interfacial reactions and measurement of its electrochemical response using cyclic voltammetry MK Mingrui Zhao, Rajesh Balachandran, Jennie Allred RSC Advances 5, 79157-79163, 2015 | 11 | 2015 |
Contactless bottom-up electrodeposition of nickel for 3D integrated circuits M Zhao, R Balachandran, Z Patterson, R Gouk, S Verhaverbeke, ... RSC Advances 5 (56), 45291-45299, 2015 | 11 | 2015 |
Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques DPR Thanu, ES Srinadhu, M Zhao, NV Dole, M Keswani Elsevier, 2019 | 7 | 2019 |
Investigations of Solution Variables in a Contactless Copper Electrodeposition Process for 3D Packaging Applications MK C Weber, Z Patterson, M Zhao, R Balachandran, R Gouk, S Verhaverbeke ... Materials Science in Semiconductor Processing 30, 578-584, 2015 | 5 | 2015 |
Gradient filling of copper in porous silicon using a non-contact electrochemical method M Zhao, F Shadman, M Keswani Applied Surface Science 445, 505-511, 2018 | 4 | 2018 |
Application of process simulation for comparison of contactless and conventional electrodeposition methods for 3D packaging M Zhao, K Jakes, K Luke, J Kishore, R Gouk, S Verhaverbeke, ... ECS Journal of Solid State Science and Technology 5 (9), P483, 2016 | 4 | 2016 |
Fabrication of radially symmetric graded porous silicon using a novel cell design M Zhao, M Keswani Scientific Reports 6 (1), 24864, 2016 | 4 | 2016 |
Characterization of Cavitation in Ultrasonic or Megasonic Irradiated Gas Saturated Solutions Using a Hydrophone M Zhao, R Balachandran, PR Madigappu, P Yam, C Zanelli, R Sierra, ... Solid State Phenomena 219, 165-169, 2014 | 4 | 2014 |
Adhesion Enhancement of Polymer Surfaces by Ion Beam Treatment ES Srinadhu, DPR Thanu, S Putta, M Zhao, B Sengupta, LP Arabandi, ... Polymer Surface Modification to Enhance Adhesion: Techniques and …, 2024 | 3 | 2024 |
Use of Surfactants in Acoustic Cleaning DPR Thanu, A Antoniswamy, VV Swaminathan, ES Srinadhu, N Dole, ... Surfactants in Precision Cleaning, 193-226, 2022 | 2 | 2022 |
Investigation of Acoustic Cavitation in Aqueous Surfactant Solutions for Cleaning Applications M Zhao, A Alobeidli, X Chen, P Yam, C Zanelli, S Maraviov, M Nagel, ... MRS Advances 1 (31), 2255-2260, 2016 | 1 | 2016 |
Hardware to uniformly distribute active species for semiconductor film processing MZ Harpreet Singh, Jallepally Ravi, Zubin Huang, Manjunatha Koppa, Sandesh ... US Patent US20230374660A1, 2023 | | 2023 |
Processing system and methods to improve productivity of void-free and seam-free tungsten gapfill process M Zhao, P Wang, K Wu, H Singh, MC Kutney WO Patent WO2022232997A1, 2022 | | 2022 |
Processing system and methods for forming void-free and seam-free tungsten features X Cen, WM Chan, K Wu, P Wang, M Zhao, MC Kutney, K Daito, H Singh WO Patent WO2022232995A1, 2022 | | 2022 |
Methods of forming void and seam free metal features X Cen, M Zhao, P Wang, WM Chan, K Wu, Y Luo, L Wu US Patent US20220359279A1, 2022 | | 2022 |