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Mingrui Zhao
Mingrui Zhao
Verified email at email.arizona.edu
Title
Cited by
Cited by
Year
Fundamentals and applications of sonic technology
DPR Thanu, M Zhao, Z Han, M Keswani
Developments in Surface Contamination and Cleaning: Applications of Cleaning …, 2019
232019
Fundamentals and applications of plasma cleaning
DPR Thanu, ES Srinadhu, M Zhao, NV Dole, M Keswani
Developments in surface contamination and cleaning: applications of cleaning …, 2019
172019
The formation mechanism of gradient porous Si in a contactless electrochemical process
M Zhao, A McCormack, M Keswani
Journal of Materials Chemistry C 4 (19), 4204-4210, 2016
162016
Characterization of stable and transient cavitation in megasonically irradiated aqueous solutions
R Balachandran, M Zhao, P Yam, C Zanelli, M Keswani
Microelectronic Engineering 133, 45-50, 2015
142015
Role of ammonia and carbonates in scavenging hydroxyl radicals generated during megasonic irradiation of wafer cleaning solutions
R Balachandran, M Zhao, B Dong, I Brown, S Raghavan, M Keswani
Microelectronic engineering 130, 82-86, 2014
132014
Synthesis of porous silicon through interfacial reactions and measurement of its electrochemical response using cyclic voltammetry
MK Mingrui Zhao, Rajesh Balachandran, Jennie Allred
RSC Advances 5, 79157-79163, 2015
112015
Contactless bottom-up electrodeposition of nickel for 3D integrated circuits
M Zhao, R Balachandran, Z Patterson, R Gouk, S Verhaverbeke, ...
RSC Advances 5 (56), 45291-45299, 2015
112015
Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques
DPR Thanu, ES Srinadhu, M Zhao, NV Dole, M Keswani
Elsevier, 2019
72019
Investigations of Solution Variables in a Contactless Copper Electrodeposition Process for 3D Packaging Applications
MK C Weber, Z Patterson, M Zhao, R Balachandran, R Gouk, S Verhaverbeke ...
Materials Science in Semiconductor Processing 30, 578-584, 2015
52015
Gradient filling of copper in porous silicon using a non-contact electrochemical method
M Zhao, F Shadman, M Keswani
Applied Surface Science 445, 505-511, 2018
42018
Application of process simulation for comparison of contactless and conventional electrodeposition methods for 3D packaging
M Zhao, K Jakes, K Luke, J Kishore, R Gouk, S Verhaverbeke, ...
ECS Journal of Solid State Science and Technology 5 (9), P483, 2016
42016
Fabrication of radially symmetric graded porous silicon using a novel cell design
M Zhao, M Keswani
Scientific Reports 6 (1), 24864, 2016
42016
Characterization of Cavitation in Ultrasonic or Megasonic Irradiated Gas Saturated Solutions Using a Hydrophone
M Zhao, R Balachandran, PR Madigappu, P Yam, C Zanelli, R Sierra, ...
Solid State Phenomena 219, 165-169, 2014
42014
Adhesion Enhancement of Polymer Surfaces by Ion Beam Treatment
ES Srinadhu, DPR Thanu, S Putta, M Zhao, B Sengupta, LP Arabandi, ...
Polymer Surface Modification to Enhance Adhesion: Techniques and …, 2024
32024
Use of Surfactants in Acoustic Cleaning
DPR Thanu, A Antoniswamy, VV Swaminathan, ES Srinadhu, N Dole, ...
Surfactants in Precision Cleaning, 193-226, 2022
22022
Investigation of Acoustic Cavitation in Aqueous Surfactant Solutions for Cleaning Applications
M Zhao, A Alobeidli, X Chen, P Yam, C Zanelli, S Maraviov, M Nagel, ...
MRS Advances 1 (31), 2255-2260, 2016
12016
Hardware to uniformly distribute active species for semiconductor film processing
MZ Harpreet Singh, Jallepally Ravi, Zubin Huang, Manjunatha Koppa, Sandesh ...
US Patent US20230374660A1, 2023
2023
Processing system and methods to improve productivity of void-free and seam-free tungsten gapfill process
M Zhao, P Wang, K Wu, H Singh, MC Kutney
WO Patent WO2022232997A1, 2022
2022
Processing system and methods for forming void-free and seam-free tungsten features
X Cen, WM Chan, K Wu, P Wang, M Zhao, MC Kutney, K Daito, H Singh
WO Patent WO2022232995A1, 2022
2022
Methods of forming void and seam free metal features
X Cen, M Zhao, P Wang, WM Chan, K Wu, Y Luo, L Wu
US Patent US20220359279A1, 2022
2022
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