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Stephan Schröder
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Year
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
2542015
Piezoresistive Properties of Suspended Graphene Membranes under Uniaxial and Biaxial Strain in Nanoelectromechanical Pressure Sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
1092016
Graphene-based CO 2 sensing and its cross-sensitivity with humidity
AD Smith, K Elgammal, X Fan, MC Lemme, A Delin, M Råsander, ...
RSC advances 7 (36), 22329-22339, 2017
582017
Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers
X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, H Rödjegård, ...
Nature Electronics 2 (9), 394-404, 2019
572019
Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications
X Fan, AD Smith, F Forsberg, S Wagner, S Schröder, SSA Akbari, ...
Microsystems & nanoengineering 6 (1), 1-17, 2020
402020
Suspended graphene membranes with attached silicon proof masses as piezoresistive nanoelectromechanical systems accelerometers
X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, M Östling, ...
Nano letters 19 (10), 6788-6799, 2019
332019
Adhesive wafer bonding with ultra-thin intermediate polymer layers
SJ Bleiker, V Dubois, S Schröder, G Stemme, F Niklaus
Sensors and Actuators A: Physical 260, 16-23, 2017
212017
Stress-minimized packaging of inertial sensors by double-sided bond wire attachment
S Schröder, F Niklaus, A Nafari, ER Westby, AC Fischer, G Stemme, ...
Journal of Microelectromechanical Systems 24 (4), 781-789, 2015
172015
Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology
AC Fischer, H Gradin, S Braun, S Schröder, G Stemme, F Niklaus
2011 IEEE 24th international conference on micro electro mechanical systems …, 2011
172011
A 500° C active down-conversion mixer in silicon carbide bipolar technology
MW Hussain, H Elahipanah, JE Zumbro, S Schröder, S Rodriguez, ...
IEEE Electron Device Letters 39 (6), 855-858, 2018
132018
Very high aspect ratio through silicon vias (TSVs) using wire bonding
S Schröder, AC Fischer, G Stemme, F Niklaus
2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013
102013
Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates
AC Fischer, H Gradin, S Schröder, S Braun, G Stemme, ...
Journal of Micromechanics and Microengineering 22 (5), 055025, 2012
102012
Biaxial strain in suspended graphene membranes for piezoresistive sensing
AD Smith, F Niklaus, S Vaziri, AC Fischer, M Sterner, F Forsberg, ...
2014 IEEE 27th international conference on micro electro mechanical systems …, 2014
92014
Stress-minimized packaging of inertial sensors using wire bonding
S Schröder, A Nafari, K Persson, E Westby, AC Fischer, G Stemme, ...
2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013
92013
An intermediate frequency amplifier for high-temperature applications
MW Hussain, H Elahipanah, S Schröder, S Rodriguez, BG Malm, ...
IEEE Transactions on Electron Devices 65 (4), 1411-1418, 2018
72018
A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool
S Schröder, H Rödjegård, G Stemme, F Niklaus
2017 19th International Conference on Solid-State Sensors, Actuators and …, 2017
62017
Fabrication of an infrared emitter using a generic integration platform based on wire bonding
S Schröder, H Rödjegård, AC Fischer, G Stemme, F Niklaus
Journal of Micromechanics and Microengineering 26 (11), 115010, 2016
52016
Temporary wafer bonding and debonding for 3D integration using an electrochemically active polymer adhesive
HK Gatty, S Schröder, F Niklaus, N Roxhed, G Stemme
ECS Journal of Solid State Science and Technology 3 (5), P115, 2014
52014
Transfer printing of nanomaterials and microstructures using a wire bonder
X Wang, S Schröder, A Enrico, S Kataria, MC Lemme, F Niklaus, ...
Journal of Micromechanics and Microengineering 29 (12), 125014, 2019
42019
Towards unconventional applications of wire bonding
S Schröder
KTH Royal Institute of Technology, 2018
42018
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