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Co-authors
- Yang LuDept of Mechanical Engineering, the University of Hong KongVerified email at hku.hk
- Ke CaoXidian University, Xi’an, ChinaVerified email at xidian.edu.cn
- Dong SunChair Professor of Biomedical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- chenchen jiangCity University of Hong KongVerified email at my.cityu.edu.hk
- Kaili ZhangProfessor, Dept. of Mechanical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Jerry TersoffIBMVerified email at us.ibm.com
- Ju Li (ORCID:0000-0002-7841-8058)Professor of Nuclear Science and Engineering and Materials Science and Engineering, MIT, USAVerified email at mit.edu
- C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
- Si LANNanjing University of Science and Technology; City University of Hong KongVerified email at cityu.edu.hk
- Xun-Li WangCity University of Hong Kong (2012 - present); Oak Ridge National Laboratory (1992-2012)Verified email at cityu.edu.hk
- Yang ShaoranCity University of Hong KongVerified email at my.cityu.edu.hk
- LI SongWigner Research Centre for PhysicsVerified email at wigner.hu
- Jyh-Pin ChouAssociate Professor, Department of Physics, National Changhua University of EducationVerified email at cc.ncue.edu.tw
- Jun LouDepartment of Materials Science and NanoEngineering, Rice UniversityVerified email at rice.edu
- Haojian LUZhejiang UniversityVerified email at zju.edu.cn
- Yajing Shen (申亚京)The Hong Kong University of Science and TechnologyVerified email at ust.hk
- TAO LIShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Qianjun HeShenzhen University
- Weidong WangXidian University, ChinaVerified email at mail.xidian.edu.cn
- Jian SongShenzhen University
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Hongti Zhang
School of Physical Science and Technology, ShanghaiTech University
Verified email at shanghaitech.edu.cn - Homepage