Sivasubramanian Thirugnanasambandam
Sivasubramanian Thirugnanasambandam
Ph.D,Industrial and Systems Engineering, Auburn University
Verified email at auburn.edu - Homepage
Title
Cited by
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Year
Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...
IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 2013
1122013
Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints
JCS Jiawei Zhang, Zhou Hai, Sivasubramanian
SMTA Journal 25 (3), 19-28, 2012
1082012
Impact of isothermal aging on the long-term reliability of fine-pitch ball grid array packages with different Sn-Ag-Cu solder joints
J Zhang, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012
292012
Proportional Hazard Model of doped low creep lead free solder paste under thermal shock
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
162016
Effects of long-term aging on SnAgCu solder joints reliability in mechanical cycling fatigue
F Akkara, S Su, S Thirugnanasambandam, A Dawahdeh, A Qasaimeh, ...
SMTA International Conference, 17-21, 2017
142017
Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys
S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
142016
Comparative study on impact of various low creep doped lead free solder alloys
A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, S Hamasha, ...
SMTA International Conference Proceedings, 2017
122017
The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages
S Thirugnanasambandam, T Sanders, A Raj, D Stone, J Evans, G Flowers, ...
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
112014
Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack
proc. 45th International Symposium on Microelectronics, 000801-000808, 2012
11*2012
Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures
S Thirugnanasambandam, J Zhang, J Evans, F Xie, M Perry, B Lewis, ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
112012
Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ...
SMTA International Proceedings, 2015
102015
The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys
N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ...
2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013
102013
Aging effects on creep behaviors of lead-free solder joints and reliability of fine-pitch packages
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...
proc. Surface Mount Technology International Conference, 2012
102012
Proportional Hazard Model of doped low creep lead free solder paste under vibration
S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
92016
DROP RELIABILITY TEST ON DIFFERENT DIMENSIONAL LEAD-FREE WAFER LEVEL CHIP SCALE PACKAGES
S Thirugnanasambandam, N Vijayakumar, J Zhang, J Evans, F Xie, ...
SMTA International, 2012
82012
Reliability of doped ball grid array components in thermal cycling after long-term isothermal aging
S Gordon, A Raj, F Akkara, S Thirugnanasambandam, T Sanders, ...
SMTA International, 438-442, 2017
72017
Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications
S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019
52019
Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders
Thomas Sanders,Sivasubramanian Thirugnanasambandam,John Evans,Michael Bozack ...
SMTA International Conference Proceedings, 2015
5*2015
Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders
Sivasubramanian Thirugnanasambandam,Thomas Sanders, John Evans, Michael ...
SMTA International Conference Proceedings, 2014
5*2014
Isothermal aging effects on the harsh environment performance of lead-free solder joints
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek
Proceedings of the SMTAI, 264-270, 2012
52012
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