| Design, Modeling, Fabrication and Characterization of 2–5- Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass … H Lu, R Furuya, BMD Sawyer, C Nair, F Liu, V Sundaram, RR Tummala IEEE transactions on components, packaging and manufacturing technology 6 (6 …, 2016 | 40 | 2016 |
| Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers H Lu, Y Takagi, Y Suzuki, B Sawyer, R Taylor, V Sundaram, R Tummala 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1416-1420, 2014 | 32 | 2014 |
| Low cost, high performance, and high reliability 2.5 D silicon interposer V Sundaram, Q Chen, T Wang, H Lu, Y Suzuki, V Smet, M Kobayashi, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 342-347, 2013 | 26 | 2013 |
| “zero-undercut” semi-additive copper patterning-a breakthrough for ultrafine-line RDL lithographic structures and precision RF thinfilm passives PM Raj, C Nair, H Lu, F Liu, V Sundaram, DW Hess, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 402-405, 2015 | 24 | 2015 |
| Modeling, design, fabrication and characterization of first large 2.5 D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch B Sawyer, H Lu, Y Suzuki, Y Takagi, M Kobayashi, V Smet, T Sakai, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 742-747, 2014 | 21 | 2014 |
| Demonstration of 2µm RDL wiring using dry film photoresists and 5µm RDL via by projection lithography for low-cost 2.5 D panel-based glass and organic interposers R Furuya, H Lu, F Liu, H Deng, T Ando, V Sundaram, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1488-1493, 2015 | 17 | 2015 |
| Effect of ultra-fine pitch RDL process variations on the electrical performance of 2.5 D glass interposers up to 110 GHz C Nair, H Lu, K Panayappan, F Liu, V Sundaram, R Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2408-2413, 2016 | 14 | 2016 |
| Via-in-trench: A revolutionary panel-based package rdl configuration capable of 200-450 io/mm/layer, an innovation for more-than-moore system integration F Liu, C Nair, A Kubo, T Ando, H Lu, R Zhang, H Chen, KS Lee, ... 2017 IEEE 67th electronic components and technology conference (ECTC), 2097-2103, 2017 | 10 | 2017 |
| Design and demonstration of large 2.5 D glass interposer for high bandwidth applications T Sakai, B Sawyer, H Lu, Y Takagi, R Furuya, Y Suzuki, M Kobayashi, ... IEEE CPMT Symposium Japan 2014, 138-141, 2014 | 9 | 2014 |
| Fabrication of high aspect ratio microfiber arrays that mimic gecko foot hairs QX SY Liu, P Zhang, H Lü, CW Zhang Chinese Science Bulletin 57 (4), 404-408, 2012 | 9 | 2012 |
| Ultra-precise low-cost surface planarization process for advanced packaging fabrications and die assembly: A survey of recent investigations on unit process applications and … F Wei, V Smet, N Shahane, H Lu, V Sundaram, R Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1740-1745, 2016 | 8 | 2016 |
| Design and demonstration of 40 micron bump pitch multi-layer RDL on panel-based glass interposers B Sawyer, Y Suzuki, Z Wu, H Lu, V Sundaram, K Panayappan, ... International Symposium on Microelectronics 2015 (1), 000379-000385, 2015 | 6 | 2015 |
| Modeling, fabrication, and reliability of through vias in polycrystalline silicon panels Q Chen, H Lu, V Sundaram, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 5 | 2015 |
| 2um RDL Wiring Using Dry Film Photoresists and 5um RDL via by Projection Lithography for Demonstration of Low Cost 2.5 D Panel-based Glasss and Organic Interposers R Furuya, F Liu, H Lu, H Deng, T Ando, V Sundaram presented at the ECTC, 2015 | 5 | 2015 |
| Demonstration of 20 um I/O Pitch RDL Using a Novel, Ultra-Thin Dry Film Photosensitive Dielectric for Panel-Based Glass Interposers A Kubo, C Nair, R Furuya, T Ando, H Lu, F Liu, V Sundaram, R Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 172-177, 2016 | 3 | 2016 |
| Advances in panel scalable planarization and high throughput differential seed layer etching processes for multilayer RDL at 20 micron I/O pitch for 2.5 D glass interposers H Lu, F Wei, R Furuya, A Kubo, F Liu, V Sundaram, R Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2210-2215, 2016 | 3 | 2016 |
| Impacts of anthropogenic disturbance on tree species composition and diversity of Fungshui forest community in Dongguan City of Guandong Province. H LÜ, S LIU, Y YE, J ZHU, L MO, H CHEN Chinese Journal of Ecology 28 (04), 613, 2009 | 2 | 2009 |
| First demonstration of photoresist cleaning for fine-line RDL yield enhancement by an innovative ozone treatment process for panel fan-out and interposers A Gupta, E Snyder, C Gottschalk, K Wenzel, J Gunn, H Lu, Y Suzuki, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 609-614, 2017 | 1 | 2017 |
| Application of Kriging-based Hydrodynamic Surrogate Model for Optimal Scheduling of Cascade Reservoirs Y XU, H LÜ, S LIU, W FANG, H QIN Journal of Yangtze River Scientific Research Institute 41 (2), 7, 2024 | | 2024 |
| First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers A Gupta, E Snyder, C Gottschalke, K Wenzel, J Gunn, H Lu, Y Suzuki, ... IMAPSource Proceedings 2017 (DPC), 1-19, 2017 | | 2017 |
