| A novel integrated decoupling capacitor for MCM-L technology P Chahal, RR Tummala, MG Allen, M Swaminathan IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 137 | 1998 |
| Terahertz characterization of dielectric substrates for component design and nondestructive evaluation of packages JA Hejase, PR Paladhi, PP Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 68 | 2011 |
| Unified AC model for the resonant tunneling diode Q Liu, A Seabaugh, P Chahal, FJ Morris IEEE Transactions on electron devices 51 (5), 653-657, 2004 | 52 | 2004 |
| Improvements and recent advances in nanocomposite capacitors using a colloidal technique V Agarwal, P Chahal, RR Tummala, MG Allen 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 47 | 1998 |
| Zero bias resonant tunnel Schottky contact diode for wide-band direct detection P Chahal, F Morris, G Frazier IEEE electron device letters 26 (12), 894-896, 2005 | 43 | 2005 |
| Method and Apparatus for Building Multilayer Circuits BD Ables, S Rajendran, P Chahal US Patent App. 12/473,044, 2010 | 34 | 2010 |
| Affordable 3D printed microwave antennas MIM Ghazali, E Gutierrez, JC Myers, A Kaur, B Wright, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 240-246, 2015 | 29 | 2015 |
| Demonstration of RF and microwave passive circuits through 3-D printing and selective metalization JA Byford, MIM Ghazali, S Karuppuswami, BL Wright, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (3 …, 2017 | 27 | 2017 |
| Microwave artificially structured periodic media microfluidic sensor N Wiwatcharagoses, KY Park, JA Hejase, L Williamson, P Chahal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1889-1893, 2011 | 26 | 2011 |
| A multiple angle method for THz time-domain material characterization JA Hejase, EJ Rothwell, P Chahal IEEE Transactions on Terahertz Science and Technology 3 (5), 656-665, 2013 | 24 | 2013 |
| Hermetic packaging of integrated circuit components P Chahal, FJ Morris US Patent 8,343,806, 2013 | 24 | 2013 |
| Integrated capacitors using polymer-ceramic composites for MCM-L P Chahal, RR Tummala, MG Allen PROCEEDINGS-SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, 126-131, 1996 | 22 | 1996 |
| Analysis of the Nicolson-Ross-Weir method for characterizing the electromagnetic properties of engineered materials EJ Rothwell, JL Frasch, SM Ellison, P Chahal, RO Ouedraogo Progress In Electromagnetics Research 157, 31-47, 2016 | 21 | 2016 |
| Electroless Ni-P/Ni-WP thin-film resistors for MCM-L based technologies P Chahal, RR Tummala, MG Allen, GE White 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 21 | 1998 |
| Affordable terahertz components using 3D printing A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2071-2076, 2015 | 19 | 2015 |
| 3D printed metalized-polymer UWB high-gain Vivaldi antennas MIM Ghazali, KY Park, JA Byford, J Papapolymerou, P Chahal 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 18 | 2016 |
| Wafer-level integration of micro-lens for THz focal plane array application KY Park, N Wiwatcharagoses, P Chahal 2013 IEEE 63rd Electronic Components and Technology Conference, 1912-1919, 2013 | 18 | 2013 |
| Integrated spectroscopic microbolometer with microfilter arrays AJ Syllaios, P Chahal US Patent 6,998,613, 2006 | 18 | 2006 |
| 3-D printed air substrates for the design and fabrication of RF components MIM Ghazali, S Karuppuswami, A Kaur, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 16 | 2017 |
| Self-calibrating technique for terahertz time-domain material parameter extraction JA Hejase, EJ Rothwell, P Chahal JOSA A 28 (12), 2561-2567, 2011 | 15 | 2011 |
Kyoung Youl ParkSenior Researcher(Ph.D), K-Milsatcom II, Agency for Defense DevelopmentVerified email at egr.msu.edu
