Molded reliability study for different Cu wire bonding configurations I Qin, H Xu, B Milton, H Clauberg, B Chylak, H Abe, D Kang, Y Endo, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1587-1594, 2013 | 16 | 2013 |
Process optimization and reliability study for Cu wire bonding advanced nodes I Qin, H Xu, B Milton, N Mendoza, H Clauberg, B Chylak, H Abe, D Kang, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1523-1528, 2014 | 14 | 2014 |
Copper high volume manufacturing R&D to production B Chylak, H Clauberg, J Foley, I Qin, B Milton 2011 IEEE 13th Electronics Packaging Technology Conference, 374-381, 2011 | 12 | 2011 |
Wire bonding looping solutions for advanced high pin count devices I Qin, B Milton, G Schulze, C Huynh, B Chylak, N Wong 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 614-621, 2016 | 11 | 2016 |
Wire bonding looping solutions for high density system-in-package (SiP) B Milton, O Kwon, C Huynh, I Qin, B Chylak International Symposium on Microelectronics 2017 (1), 000426-000431, 2017 | 8 | 2017 |
Smart Wire Bond Solutions for SiP and Memory Packages B Milton, A Shah, H Xu, O Kwon, G Schulze, I Qin, N Wong 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 55-62, 2019 | 6 | 2019 |
Wire Bonding Advances for Multi-Chip and System in Package Devices H Xu, A Shah, B Milton, I Qin International Symposium on Microelectronics 2018 (1), 000583-000588, 2018 | 5 | 2018 |
Characterization of a wire bonding process with the added challenges from palladium-coated copper wires ACK Chang, ABY Lim, CX Lee, B Milton, H Clauberg, O Yauw, B Chylak 2012 35th IEEE/CPMT International Electronics Manufacturing Technology …, 2012 | 5 | 2012 |
Ultra low loop conversion from gold to copper wire LK Fang, OD Kwon, O Yauw, D Capistrano, B Milton 2010 34th IEEE/CPMT International Electronic Manufacturing Technology …, 2010 | 5 | 2010 |
Biologically inspired drug delivery microrobots WR Hesse, DM Casale, B Milton, PK Fink, MJ Kim The 5th International Conference on Microtechnologies in Medicine and …, 2009 | 3 | 2009 |
Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops B Milton, W Qin US Patent 10,672,735, 2020 | 1 | 2020 |
Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops B Milton, W Qin US Patent 10,325,878, 2019 | 1 | 2019 |
Smart wire bonding processes for smart factories I Qin, A Shah, B Milton, G Schulze, A Chang, N Wong 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 411-415, 2018 | 1 | 2018 |
Optimizing Ag wire bonding for memory devices I Qin, T Rockey, B Milton, G Schulze, R Olida, B Chylak, A Chang, N Wong 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-6, 2017 | 1 | 2017 |
Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine B Milton, W Qin, Z Wang, V Pribula, P Shusharin US Patent App. 18/125,152, 2023 | | 2023 |
Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methods B Milton, W Qin US Patent App. 18/121,100, 2023 | | 2023 |
Methods of determining suitability of a wire bonding tool for a wire bonding application, and related methods B Milton, W Qin US Patent App. 18/116,798, 2023 | | 2023 |
Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece B Milton, DJ Li, W Qin US Patent App. 18/109,344, 2023 | | 2023 |
Digital Twins and Smart Manufacturing for Wire Bonding B Milton, R Cathcart, O Kwon, P Shusharin, I Qin IMAPSource Proceedings 2022 (1), 000317-000323, 2023 | | 2023 |
Methods of forming wire interconnect structures and related wire bonding tools B Milton, R Olida, J Geller, T Levinson US Patent App. 17/550,729, 2022 | | 2022 |