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Basil Milton
Basil Milton
Kulicke & Soffa
Verified email at kns.com
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Cited by
Cited by
Year
Molded reliability study for different Cu wire bonding configurations
I Qin, H Xu, B Milton, H Clauberg, B Chylak, H Abe, D Kang, Y Endo, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 1587-1594, 2013
162013
Process optimization and reliability study for Cu wire bonding advanced nodes
I Qin, H Xu, B Milton, N Mendoza, H Clauberg, B Chylak, H Abe, D Kang, ...
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1523-1528, 2014
142014
Copper high volume manufacturing R&D to production
B Chylak, H Clauberg, J Foley, I Qin, B Milton
2011 IEEE 13th Electronics Packaging Technology Conference, 374-381, 2011
122011
Wire bonding looping solutions for advanced high pin count devices
I Qin, B Milton, G Schulze, C Huynh, B Chylak, N Wong
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 614-621, 2016
112016
Wire bonding looping solutions for high density system-in-package (SiP)
B Milton, O Kwon, C Huynh, I Qin, B Chylak
International Symposium on Microelectronics 2017 (1), 000426-000431, 2017
82017
Smart Wire Bond Solutions for SiP and Memory Packages
B Milton, A Shah, H Xu, O Kwon, G Schulze, I Qin, N Wong
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 55-62, 2019
62019
Wire Bonding Advances for Multi-Chip and System in Package Devices
H Xu, A Shah, B Milton, I Qin
International Symposium on Microelectronics 2018 (1), 000583-000588, 2018
52018
Characterization of a wire bonding process with the added challenges from palladium-coated copper wires
ACK Chang, ABY Lim, CX Lee, B Milton, H Clauberg, O Yauw, B Chylak
2012 35th IEEE/CPMT International Electronics Manufacturing Technology …, 2012
52012
Ultra low loop conversion from gold to copper wire
LK Fang, OD Kwon, O Yauw, D Capistrano, B Milton
2010 34th IEEE/CPMT International Electronic Manufacturing Technology …, 2010
52010
Biologically inspired drug delivery microrobots
WR Hesse, DM Casale, B Milton, PK Fink, MJ Kim
The 5th International Conference on Microtechnologies in Medicine and …, 2009
32009
Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
B Milton, W Qin
US Patent 10,672,735, 2020
12020
Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
B Milton, W Qin
US Patent 10,325,878, 2019
12019
Smart wire bonding processes for smart factories
I Qin, A Shah, B Milton, G Schulze, A Chang, N Wong
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 411-415, 2018
12018
Optimizing Ag wire bonding for memory devices
I Qin, T Rockey, B Milton, G Schulze, R Olida, B Chylak, A Chang, N Wong
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-6, 2017
12017
Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine
B Milton, W Qin, Z Wang, V Pribula, P Shusharin
US Patent App. 18/125,152, 2023
2023
Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methods
B Milton, W Qin
US Patent App. 18/121,100, 2023
2023
Methods of determining suitability of a wire bonding tool for a wire bonding application, and related methods
B Milton, W Qin
US Patent App. 18/116,798, 2023
2023
Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece
B Milton, DJ Li, W Qin
US Patent App. 18/109,344, 2023
2023
Digital Twins and Smart Manufacturing for Wire Bonding
B Milton, R Cathcart, O Kwon, P Shusharin, I Qin
IMAPSource Proceedings 2022 (1), 000317-000323, 2023
2023
Methods of forming wire interconnect structures and related wire bonding tools
B Milton, R Olida, J Geller, T Levinson
US Patent App. 17/550,729, 2022
2022
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