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Co-authors
- Himanshu MadanIntel, PennState UniversityVerified email at intel.com
- Brian R. BennettWashington-Liberty High School; formerly Naval Research Laboratory (NRL), ONR, and MITVerified email at navy.mil
- Ashish AgrawalDevcie Engineer at Components Research, Intel CorporationVerified email at intel.com
- Rajiv MisraUniversity of Florida, The Pennsylvania State UniversityVerified email at ufl.edu
- Dheeraj MohataSenior Integration Engineer, GCS IncVerified email at gcsincorp.com
- Prof. Mantu HudaitAssoc. Prof. of ECE, Virginia Tech; Past: Intel Corporation, Ohio State U, IISc-Bangalore, IIT-KGPVerified email at vt.edu
- Robert M. WallaceUniversity of Texas at DallasVerified email at utdallas.edu
- Jeffrey LindemuthLake Shore CryotronicsVerified email at lakeshore.com
- Matthew J. HollanderPennsylvania State UniversityVerified email at psu.edu
- Lu LiuIntel CorporationVerified email at intel.com
- Bijesh RajamohananSanDisk
- Dr. Satyam SuwasProfessor of Materials Engineering, Indian Institute of Science, BangaloreVerified email at iisc.ac.in
- Alexander P. KirkCentral R&D LLC