| Long term aging effects on the reliability of lead free solder joints in ball grid array packages with various pitch sizes and ball alignments C Zhao, C Shen, Z Hai, J Zhang, MJ Bozack, JL Evans SMTA International, 2015 | 67 | 2015 |
| Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes JCS Z Hai, J Zhang, C Shen, JL Evans, MJ Bozack, MM Basit IEEE, 2015 | 65* | 2015 |
| Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term High Temperature Aging Z Hai, J Zhang, C Shen, EK Snipes, JC Suhling, MJ Bozack, JL Evans SMTA Journal 27 (2), 11-18, 2014 | 41 | 2014 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Materials 10 (5), 451, 2017 | 29 | 2017 |
| Long-term aging effects on reliability performance of lead-free solder joints Z Hai, J Zhang, C Shen, JL Evans, MJ Bozack Proc. Surface Mount Technology International Conference, 362-370, 2013 | 15 | 2013 |
| Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment C Zhao, T Sanders, Z Hai, C Shen, JL Evans International Symposium on Microelectronics 2016 (1), 000117-000122, 2016 | 14 | 2016 |
| Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling C Shen, C Zhao, Z Hai, J Zhang, MJ Bozack, JC Suhling, JL Evans International Symposium on Microelectronics 2015 (1), 000135-000140, 2015 | 6 | 2015 |
| Effects on the reliability of lead-free solder joints under harsh environment Z Hai, J Zhang, C Shen, C Zhao, JL Evans, MJ Bozack International Symposium on Microelectronics 2014 (1), 000471-000476, 2014 | 5 | 2014 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling. Materials, 2017, 10 (5): 451-464 CB Shen, Z Hai, C Zhao, JW Zhang, JL Evans, MJ Bozack, JC Suhling ed, 0 | 5 | |
| Reliability performance of lead-free SAC solder joints on ENIG and ENEPIG subject to long-term isothermal aging Z Hai, J Zhang, C Shen, EK Snipes, JC Suhling, MJ Bozack, JL Evans J. Mechatron 2 (10.1166), 2014 | 4 | 2014 |
| Reliability analysis of aging in joint microstructures for Sn-Ag-Cu solder joints during thermal cycling C Shen, Z Hai, C Zhao, J Zhang, MJ Bozack, JC Suhling, JL Evans International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 3 | 2015 |
| The Effect of Isothermal Aging on the Reliability of Sn-Ag-Cu Solder Joints Using Various Surface Finishes CS Zhou Hai, Cong Zhao, Jiawei Zhang, John L. Evans, M. J. Bozack SMTA International 2014, 2014 | 3* | 2014 |
| Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Journal of Mechatronics 3 (4), 269-275, 2016 | 1 | 2016 |
| RELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING C Zhao, T Sanders, C Shen, Z Hai, JL Evans, MJ Bozack, J Suhling | 1 | |
