| A review of advanced thermal management solutions and the implications for integration in high-voltage packages AC Iradukunda, DR Huitink, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 256-271, 2019 | 67 | 2019 |
| Additive manufacturing for enhancing thermal dissipation in heat sink implementation: a review BM Nafis, R Whitt, AC Iradukunda, D Huitink Heat Transfer Engineering 42 (12), 967-984, 2021 | 58 | 2021 |
| Transient thermal performance using phase change material integrated topology optimized heat sinks AC Iradukunda, A Vargas, D Huitink, D Lohan Applied Thermal Engineering 179, 115723, 2020 | 54 | 2020 |
| Stacked DBC cavitied substrate for a 15-kV half-bridge power module A Deshpande, F Luo, A Iradukunda, D Huitink, L Boteler 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 12-17, 2019 | 31 | 2019 |
| A Tutorial on High-Density Power Module Packaging Y Chen, A Iradukunda, HA Mantooth, Z Chen, D Huitink IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (3 …, 2022 | 12 | 2022 |
| Concurrent thermal and electrical property effects of nano-enhanced phase change material for high-voltage electronics applications AC Iradukunda, J Kasitz, H Carlton, D Huitink, A Deshpande, F Luo Journal of Electronic Packaging 142 (3), 031109, 2020 | 11 | 2020 |
| System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials BM Nafis, AC Iradukunda, D Huitink Journal of Electronic Packaging 142 (4), 041108, 2020 | 10 | 2020 |
| Topology optimized phase change material integrated heat sinks and validation A Vargas, D Huitink, AC Iradukunda, C Eddy 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 6 | 2020 |
| Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters BM Nafis, A Iradukunda, D Huitink International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 6 | 2018 |
| Hfe7500 Coolant Dielectric Strength Augmentation Under Convective Conditions AC Iradukunda, D Huitink, K Kayijuka, T Gebrael, N Miljkovic Journal of Electronic Packaging 145 (1), 011105, 2023 | 4 | 2023 |
| Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter W Vinson, A Iradukunda, D Huitink, JP Lee, M Kwon, CY Oh 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 3 | 2021 |
| Topology Optimized Fins for a PCM-Based Thermal Management System AC Iradukunda, D Huitink 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 3 | 2019 |
| Combined Integration Of Phase Change Materials Into Conduction-Convection-Latent Heat Optimized Thermal Management Through Novel Geometries Enabled In Additive Manufactured … D Huitink, AC Iradukunda US Patent App. 16/657,792, 2020 | 2 | 2020 |
| System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles BM Nafis, AC Iradukunda, I Al Razi, DR Huitink, Y Peng International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 2 | 2019 |
| Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics H Carlton, A Iradukunda, A Imran, S Myane, N Akey, F Luo, D Huitink Journal of Electronic Packaging 144 (2), 024502, 2022 | 1 | 2022 |
| Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules AC Iradukunda, D Huitink, T Gebrael, N Miljkovic International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 1 | 2021 |
| Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems AC Iradukunda, J Kasitz, F Moreno, D Huitink International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 1 | 2019 |
| Toward Direct Cooling In High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal AC Iradukunda, BM Nafis, D Huitink, Y Chen, HA Mantooth, G Campbell, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Fabrication Process Optimization of A High-Power Double-Sided Cooled SiC Power Module Y Chen, L Du, X Du, M Alher, A Iradukunda, D Huitink, Z Chen, ... 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 5900-5905, 2023 | | 2023 |
| Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics AC Iradukunda, D Huitink, T Gebrael, N Miljkovic International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | | 2022 |
