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Co-authors
Zhifeng ShiZhengzhou UniversityVerified email at zzu.edu.cn
chongxin shanZhengzhou UniversityVerified email at zzu.edu.cn
Longhui ZENGThe Hong Kong Polytechnic UniversityVerified email at mail.hfut.edu.cn
Yuen Hong TsangAssociate Professor, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学电子科学与应用物理学院教授)Verified email at hfut.edu.cn
Xinzheng LanHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Chao XieHefei University of TechnologyVerified email at hfut.edu.cn
Huiyu Yuan(原会雨)Zhengzhou UniversityVerified email at zzu.edu.cn
Vivian YamChair Professor of Chemistry, The University of Hong KongVerified email at hku.hk
Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
Dongwen YangJilin universityVerified email at mails.jlu.edu.cn
Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
Shenghuang Lin(林生晃)Songshan Lake Materials LaboratoryVerified email at sslab.org.cn
Lijun ZhangVerified email at ios.ac.cn
Yang ChaiUniversity of Southern CaliforniaVerified email at usc.edu
Lei ChenHefei University of TechnologyVerified email at hfut.edu.cn
Vonika Ka-Man AuThe Education University of Hong KongVerified email at hku.hk
Di Wu (吴翟)
Professor, School of Physics and Microelectronics, Zhengzhou University
Verified email at zzu.edu.cn