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### Co-authors

- Chuan XiaUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Yongjiu LeiKAUSTVerified email at kaust.edu.sa
- Qiu JiangUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Wenli ZhangGuangdong University of TechnologyVerified email at gdut.edu.cn
- xixiang zhangProfessor, King Abdullah University of Science and Technology(KAUST)Verified email at kaust.edu.sa
- Rakhi R.B.Principal Scientist, CSIR-NIISTVerified email at niist.res.in
- Wei ChenUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Fang-Wang MingKAUST, Xiamen UniversityVerified email at kaust.edu.sa
- Omar F. Mohammed, PhD, FRSC, FIM...Professor, Materials Science & Engineering, King Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- Byoung Hun LeePohang University of Science and TechnologyVerified email at postech.ac.kr
- Hyunho KimA.J. Drexel Nanomaterials Institute, Drexel University; ICL; KAUSTVerified email at drexel.edu
- prashant majhiIntel Corp.Verified email at intel.com
- Dalaver H. AnjumDepartment of Physics, Khalifa UniversityVerified email at ku.ac.ae
- Yunpei ZhuKAUSTVerified email at kaust.edu.sa
- Jehad K. El-DemellawiR&D Scientist @ Aramco; KAUSTVerified email at kaust.edu.sa
- Jun MingChinese Acdemic of Sciences, Hanyang University, The University of Tokyo, King Abdullah UniversityVerified email at kaust.edu.sa
- Mohamed EddaoudiKing Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
- Abdul-Hamid EmwasKAUSTVerified email at kaust.edu.sa
- Yury GogotsiA.J. Drexel Nanomaterials Institute, Department of Materials Science and Engineering, DrexelVerified email at drexel.edu
- Zhenwei WangNational Institute of Information and Communications TechnologyVerified email at nict.go.jp