| Fuzzy neural network approach to optimizing process performance by using multiple responses A Al-Refaie, T Chen, R Al-Athamneh, HC Wu Journal of Ambient Intelligence and Humanized Computing 7, 801-816, 2016 | 35 | 2016 |
| Fatigue behavior of SAC-Bi and SAC305 solder joints with aging R Al Athamneh IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 29 | 2019 |
| Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test R Al Athamneh, DB Hani, H Ali Microelectronics Reliability 104, 113507, 2020 | 27 | 2020 |
| Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cycling FJ Akkara, C Zhao, R Athamenh, S Su, M Abueed, S Hamasha, J Suhling, ... 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 26 | 2018 |
| The effect of Bi on the mechanical properties of aged SAC solder joint MEA Belhadi, FJ Akkara, R Athamenh, M Abueed, H Ali, J Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 22 | 2020 |
| Effect of aging on the fatigue life and shear strength of SAC305 solder joints in actual setting conditions R Al Athamneh, M Abueed, DB Hani, S Su, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 21 | 2019 |
| Mechanical Properties of SAC-BI Solder Alloys With Aging M Belhad, L Wentlent, R Alathamneh, S Hamasha SMTA International Conference Proceedings 2019, 2019 | 18 | 2019 |
| Effect Of Aging on SAC 305 Solder Joints Reliability in Accelerated Fatigue Shear Test RA Athamneh, M Abueed, DB Hani, S Hamasha SMTA International Conference Proceedings 2018, 2018 | 15 | 2018 |
| Fatigue life degradation modeling of SnAgCu solder joints after aging R Al Athamneh, DB Hani, H Ali IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 12 | 2020 |
| Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal Cycling M Abueed, R Alathamneh, S Hamasha SMTA International Conference Proceedings 2019, 2019 | 8 | 2019 |
| Channel estimation for reconfigurable intelligent surface-assisted mmWave based on Re ‘nyi entropy function Z Albataineh, KF Hayajneh, H Shakhatreh, RA Athamneh, M Anan Scientific reports 12 (1), 22301, 2022 | 7 | 2022 |
| Shear strength degradation modeling of lead-free solder joints at different isothermal aging conditions DB Hani, R Al Athamneh, M Aljarrah, S Hamasha Journal of Microelectronics and Electronic Packaging 18 (3), 137-144, 2021 | 6 | 2021 |
| A PDCA framework towards a multi-response optimization of process parameters based on Taguchi-Fuzzy model M Tanash, R Al Athamneh, D Bani Hani, M Rababah, Z Albataineh Processes 10 (9), 1894, 2022 | 5 | 2022 |
| Effect of Fatigue on Individual SAC305 Solder Joints Reliability at Elevated Temperature M Abueed, R Athamenh, J Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
| Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model D Bani Hani, R Al Athamneh, M Abueed, S Hamasha Scientific Reports 13 (1), 2493, 2023 | 4 | 2023 |
| The reliability of SAC305 individual solder joints during creep–fatigue conditions at room temperature M Abueed, R Al Athamneh, M Tanash, S Hamasha Crystals 12 (9), 1306, 2022 | 4 | 2022 |
| Fuzzy approach for reliability modeling of lead-free solder joints in elevated temperature environmental conditions R Al Athamneh, M Abueed, D Bani Hani, S Hamasha Crystals 12 (6), 775, 2022 | 4 | 2022 |
| Effect of aging temperature on the fatigue resistance and shear strength of SAC305 solder joints DB Hani, R Al Athamneh IEEE Transactions on Device and Materials Reliability 22 (2), 239-247, 2022 | 4 | 2022 |
| Factor Analysis of Quality Management Systems Implementation in Healthcare: An Online Survey M Rawshdeh, H Keathley, S Obeidat, R Athamenh, M Tanash, ... Healthcare 10 (10), 1828, 2022 | 3 | 2022 |
| Reliability modeling of microelectronic interconnections in long-term applications R Al Athamneh Auburn University, 2019 | 3 | 2019 |
