| Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging S Wang, M Li, H Ji, C Wang Scripta Materialia 69 (11-12), 789-792, 2013 | 176 | 2013 |
| Highly conductive Cu–Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles J Liu, H Chen, H Ji, M Li ACS applied materials & interfaces 8 (48), 33289-33298, 2016 | 168 | 2016 |
| Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7 Cu solder for high temperature packaging application H Ji, Y Qiao, M Li Scripta Materialia 110, 19-23, 2016 | 106 | 2016 |
| Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering M Yang, H Ji, S Wang, YH Ko, CW Lee, J Wu, M Li Journal of Alloys and Compounds 679, 18-25, 2016 | 100 | 2016 |
| Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal Y Xiao, H Ji, M Li, J Kim Materials & Design (1980-2015) 52, 740-747, 2013 | 94 | 2013 |
| Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles S Wang, H Ji, M Li, C Wang Materials Letters 85, 61-63, 2012 | 90 | 2012 |
| Wearable circuits sintered at room temperature directly on the skin surface for health monitoring L Zhang, H Ji, H Huang, N Yi, X Shi, S Xie, Y Li, Z Ye, P Feng, T Lin, X Liu, ... ACS Applied Materials & Interfaces 12 (40), 45504-45515, 2020 | 68 | 2020 |
| Droplet‐based microfluidics systems in biomedical applications H Feng, T Zheng, M Li, J Wu, H Ji, J Zhang, W Zhao, J Guo Electrophoresis 40 (11), 1580-1590, 2019 | 68 | 2019 |
| Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging H Ji, M Li, S Ma, M Li Materials & Design 108, 590-596, 2016 | 65 | 2016 |
| Ultra-low temperature sintering of Cu@ Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging H Ji, J Zhou, M Liang, H Lu, M Li Ultrasonics sonochemistry 41, 375-381, 2018 | 64 | 2018 |
| Highly sensitive and transparent strain sensors with an ordered array structure of AgNWs for wearable motion and health monitoring F Yin, H Lu, H Pan, H Ji, S Pei, H Liu, J Huang, J Gu, M Li, J Wei Scientific reports 9 (1), 2403, 2019 | 61 | 2019 |
| A wearable real-time power supply with a Mg3Bi2-based thermoelectric module Y Liu, L Yin, W Zhang, J Wang, S Hou, Z Wu, Z Zhang, C Chen, X Li, H Ji, ... Cell Reports Physical Science 2 (5), 2021 | 47 | 2021 |
| Multi-layer silver nanowire/polyethylene terephthalate mesh structure for highly efficient transparent electromagnetic interference shielding J Gu, S Hu, H Ji, H Feng, W Zhao, J Wei, M Li Nanotechnology 31 (18), 185303, 2020 | 44 | 2020 |
| Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal Y Xiao, H Ji, M Li, J Kim, H Kim Materials & Design 47, 717-724, 2013 | 44 | 2013 |
| Evolution of the bulk microstructure in 1100 aluminum builds fabricated by ultrasonic metal welding H Ji, J Wang, M Li Journal of Materials Processing Technology 214 (2), 175-182, 2014 | 43 | 2014 |
| Enhancing the solid/liquid interfacial metallurgical reaction of Sn+ Cu composite solder by ultrasonic-assisted chip attachment H Pan, J Huang, H Ji, M Li Journal of Alloys and Compounds 784, 603-610, 2019 | 41 | 2019 |
| Microstructural evolution and degradation mechanism of SiC–Cu chip attachment using sintered nano-Ag paste during high-temperature ageing F Yang, W Zhu, W Wu, H Ji, C Hang, M Li Journal of Alloys and Compounds 846, 156442, 2020 | 40 | 2020 |
| Interdiffusion of Al–Ni system enhanced by ultrasonic vibration at ambient temperature M Li, H Ji, C Wang, HS Bang, HS Bang Ultrasonics 45 (1-4), 61-65, 2006 | 40 | 2006 |
| Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process H Ji, M Li, C Wang, J Guan, HS Bang Journal of Materials Processing Technology 182 (1-3), 202-206, 2007 | 38 | 2007 |
| Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint Y Xiao, H Ji, M Li, J Kim Materials Science and Engineering: A 594, 135-139, 2014 | 32 | 2014 |
