| Experimental and 3D micromechanical analysis of stress–strain behavior and damage initiation in dual-phase steels B Anbarlooie, H Hosseini-Toudeshky, M Hosseini, J Kadkhodapour Journal of Materials Engineering and Performance 28 (5), 2903-2918, 2019 | 15 | 2019 |
| Residual stress measurement through the thickness of ball grid array microelectronics packages using incremental hole drilling SM Hosseini, S Akbari, MM Shokrieh Microelectronics Reliability 102, 113473, 2019 | 7 | 2019 |
| Numerical and experimental studies of fabrication-induced thermal residual stresses in microelectronic packages SM Hosseini, S Akbari, MM Shokrieh IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 4 | 2021 |
| Micromechanical failure analysis and tensile behavior of dual phase steel using 2D and 3D RVEs B Anbarlooie, M Hosseini, H Hosseini-Toudeshky Amirkabir Journal of Mechanical Engineering 51, 21-30, 2019 | 3 | 2019 |
| An Overview of Basic Concepts of Finite Element Analysis and Its Applications in Orthodontics S. Rastegari, S. M. Hosseini, Mojtaba Hasani, Abdolreza Jamilian The Journal of Dentists 11, 23-30, 2023 | | 2023 |
| Micromechanical Failure Analyses and Tensile Behavior of Dual Phase Steel Using Two and Three-Dimensional Representative Volume Elements B Anbarlooie, M Hosseini, H Hosseini-Toudeshky | | 2019 |
Behnam AnbarlooieAssistant Professor, Shahid Beheshti UniversityAdresse e-mail validée de aut.ac.ir
