| Silicon photonic circuits: on-CMOS integration, fiber optical coupling, and packaging C Kopp, S Bernabe, BB Bakir, JM Fedeli, R Orobtchouk, F Schrank, ... IEEE Journal of selected topics in quantum electronics 17 (3), 498-509, 2010 | 301 | 2010 |
| Review of packaging of optoelectronic, photonic, and MEMS components T Tekin IEEE Journal of selected topics in quantum electronics 17 (3), 704-719, 2011 | 129 | 2011 |
| Active plasmonics in WDM traffic switching applications S Papaioannou, D Kalavrouziotis, K Vyrsokinos, JC Weeber, K Hassan, ... Scientific reports 2 (1), 652, 2012 | 97 | 2012 |
| Dielectric‐loaded plasmonic waveguide components: going practical A Kumar, J Gosciniak, VS Volkov, S Papaioannou, D Kalavrouziotis, ... Laser & Photonics Reviews 7 (6), 938-951, 2013 | 77 | 2013 |
| Triple transit region photodiodes (TTR-PDs) providing high millimeter wave output power V Rymanov, A Stöhr, S Dülme, T Tekin Optics Express 22 (7), 7550-7558, 2014 | 66 | 2014 |
| Interfacing dielectric-loaded plasmonic and silicon photonic waveguides: theoretical analysis and experimental demonstration O Tsilipakos, A Pitilakis, TV Yioultsis, S Papaioannou, K Vyrsokinos, ... IEEE Journal of Quantum Electronics 48 (5), 678-687, 2012 | 57 | 2012 |
| How to bring nanophotonics to application-silicon photonics packaging L Zimmermann, T Tekin, H Schroeder, P Dumon, W Bogaerts IEEE LEOS Newsletter 22 (6), 4-14, 2008 | 49 | 2008 |
| Packaging and assembly for integrated photonics—A review of the ePIXpack photonics packaging platform L Zimmermann, GB Preve, T Tekin, T Rosin, K Landles IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 645-651, 2010 | 48 | 2010 |
| Dual SOA-MZI Wavelength Converters Based on III-V Hybrid Integration on a -Scale Si Platform D Fitsios, T Alexoudi, GT Kanellos, K Vyrsokinos, N Pleros, T Tekin, ... IEEE Photonics Technology Letters 26 (6), 560-563, 2014 | 47 | 2014 |
| 0.48 Tb/s (12x40Gb/s) WDM transmission and high-quality thermo-optic switching in dielectric loaded plasmonics D Kalavrouziotis, S Papaioannou, G Giannoulis, D Apostolopoulos, ... Optics Express 20 (7), 7655-7662, 2012 | 43 | 2012 |
| Silicon photonics for terabit/s communication in data centers and exascale computers S Bernabe, Q Wilmart, K Hasharoni, K Hassan, Y Thonnart, P Tissier, ... Solid-State Electronics 179, 107928, 2021 | 35 | 2021 |
| Optical Interconnects for Data Centers T Tekin, N Pleros, R Pitwon, A Hakansson Woodhead Publishing, 2016 | 31 | 2016 |
| WDM-enabled optical RAM at 5 Gb/s using a monolithic InP flip-flop chip S Pitris, C Vagionas, T Tekin, R Broeke, GT Kanellos, N Pleros IEEE Photonics Journal 8 (2), 1-7, 2016 | 31 | 2016 |
| Robust 71-76 GHz radio-over-fiber wireless link with high-dynamic range photonic assisted transmitter and laser phase-noise insensitive SBD receiver A Stöhr, O Cojucari, F van Dijk, G Carpintero, T Tekin, S Formont, ... Optical Fiber Communication Conference, M2D. 4, 2014 | 31 | 2014 |
| Data Transmission and Thermo-Optic Tuning Performance of Dielectric-Loaded Plasmonic Structures Hetero-Integrated on a Silicon Chip G Giannoulis, D Kalavrouziotis, D Apostolopoulos, S Papaioannou, ... Photonics Technology Letters, IEEE 24 (5), 374 - 376, 2011 | 31 | 2011 |
| Compact Metamaterial-based Bias Tee Design for 1.55 μm Waveguide-photodiode Based 71–76 GHz Wireless Transmitter M Palandöken, V Rymanov, A Stöhr, T Tekin Progress In Electromagnetics Research Symposium 2012 Moscow, 393-397, 2012 | 29 | 2012 |
| Compact modules for wireless communication systems in the E-band (71–76 GHz) J Montero-de-Paz, I Oprea, V Rymanov, S Babiel, LE García-Muñoz, ... Journal of Infrared, Millimeter, and Terahertz Waves 34, 251-266, 2013 | 28 | 2013 |
| Integrated Photonic 71-76 GHz Transmitter Module Employing High Linearity Double Mushroom-Type 1.55 μm Waveguide Photodiodes V Rymanov, M Palandöken, S Lutzmann, B Bouhlal, T Tekin, A Stöhr 2012 International Topical Meeting on Microwave Photonics (MWP), 253-256, 2012 | 25 | 2012 |
| Monolithically integrated MZI comprising band gap shifted SOAs: a new switching scheme for generic all-optical signal processing T Tekin, M Schlak, W Brinker, B Maul, R Molt Proc. of 26th Europ. Conf. Opt. Commun.(ECOC'2000) 3, 123-124, 2000 | 24 | 2000 |
| 3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through … B Sirbu, Y Eichhammer, H Oppermann, T Tekin, J Kraft, V Sidorov, X Yin, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1052-1059, 2019 | 23 | 2019 |
