| Method of making integrated circuit package having multiple bonding tiers KG Newman US Patent 5,490,324, 1996 | 168 | 1996 |
| BGA brittle fracture-alternative solder joint integrity test methods K Newman Proceedings Electronic Components and Technology, 2005. ECTC'05., 1194-1201, 2005 | 163 | 2005 |
| High-speed solder ball shear and pull tests vs. board level mechanical drop tests: correlation of failure mode and loading speed F Song, SWR Lee, K Newman, B Sykes, S Clark 2007 Proceedings 57th Electronic Components and Technology Conference, 1504-1513, 2007 | 88 | 2007 |
| Integrated circuit package lid KG Newman US Patent 5,455,456, 1995 | 80 | 1995 |
| Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests F Song, SWR Lee, K Newman, B Sykes, S Clark 2007 Proceedings 57th Electronic Components and Technology Conference, 364-372, 2007 | 77 | 2007 |
| Integral dam and heat sink for semiconductor device assembly S Patil, A Murphy, K Newman US Patent 5,227,663, 1993 | 72 | 1993 |
| Reliability evaluations of lead-free SnAgCu PBGA676 components using tin-lead and lead-free SnAgCu solder paste J Bath, S Sethuraman, X Zhou, D Willie, K Hyland, K Newman, L Hu, ... Proceedings of SMTAI 891, 2005 | 69 | 2005 |
| Method and apparatus for controlling adhesive spreading when attaching an integrated circuit die KG Newman US Patent 5,409,863, 1995 | 39 | 1995 |
| Comparison of thermal fatigue performance of SAC105 (Sn-1.0 Ag-0.5 Cu), Sn-3.5 Ag, and SAC305 (Sn-3.0 Ag-0.5 Cu) BGA components with SAC305 solder paste G Henshall, J Bath, S Sethuraman, D Geiger, A Syed, MJ Lee, K Newman, ... Proceedings of IPC APEX, 2009 | 36 | 2009 |
| Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls F Song, SWR Lee, K Newman, H Reynolds, S Clark, B Sykes 2007 9th Electronics Packaging Technology Conference, 463-470, 2007 | 32 | 2007 |
| Method and system for fabricating IC packages from laminated boards and heat spreader KG Newman US Patent 5,357,672, 1994 | 32 | 1994 |
| Method of making a flexible heater comprising a conductive polymer KG Newman US Patent 4,919,744, 1990 | 29 | 1990 |
| Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints K Yokomine, N Shimizu, Y Miyamoto, Y Iwata, D Love, K Newman 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001 | 28 | 2001 |
| Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test F Song, SWR Lee, K Newman, S Clark, B Sykes 2007 9th Electronics Packaging Technology Conference, 450-458, 2007 | 21 | 2007 |
| Board‐Level Solder Joint Reliability of High‐Performance Computers Under Mechanical Loading K Newman Lead‐Free Solder Process Development, 173-204, 2011 | 18 | 2011 |
| Comparative study of PWB pad cratering subject to reflow soldering and thermal impact C Yang, F Song, SWR Lee, K Newman 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 16 | 2010 |
| Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors F Song, C Yang, HLH Wu, CCJ Lo, SWR Lee, K Newman 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 14 | 2010 |
| Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis F Song, K Newman, C Yang, SWR Lee 2009 11th Electronics Packaging Technology Conference, 863-868, 2009 | 14 | 2009 |
| Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability HLH Wu, F Song, JCC Lo, T Jiang, K Newman, SWR Lee 2009 59th Electronic Components and Technology Conference, 125-133, 2009 | 12 | 2009 |
| Integrated strain gages for board strain characterization BC Ong, KG Newman US Patent 7,036,387, 2006 | 11 | 2006 |
