| Elaboration and characterization of a 200 mm stretchable and flexible ultra-thin semi-conductor film LG Michaud, C Castan, M Zussy, P Montméat, VH Mareau, L Gonon, ... Nanotechnology 31 (14), 145302, 2020 | 6 | 2020 |
| Aluminium-nitride thin-films on polymer substrates obtained by adhesive bonding E Azrak, LG Michaud, A Reinhardt, S Tardif, M Bousquet, N Vaxelaire, ... ECS Journal of Solid State Science and Technology 10 (6), 064001, 2021 | 3 | 2021 |
| Large scale integration of functional radio‐frequency flexible MEMS under large mechanical strain E Azrak, L Michaud, J Richy, A Reinhardt, S Tardif, J Eymery, M Bousquet, ... Advanced Functional Materials 33 (4), 2205404, 2023 | 2 | 2023 |
| Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding Q Lomonaco, K Abadie, C Morales, LG Michaud, J Richy, S Moreau, ... ECS Transactions 109 (4), 277, 2022 | 2 | 2022 |
| Transfer of an ultrathin single-crystal silicon film from a silicon-on-insulator to a polymer LG Michaud, E Azrak, C Castan, F Fournel, F Rieutord, S Tardif, ... Materials Today Nano 13, 100107, 2021 | 2 | 2021 |
| Edge Bonding Voids Management Using Humid Helium Bonding Atmosphere F Fournel, V Larrey, C Morales, LG Michaud ECS Transactions 112 (3), 15, 2023 | 1 | 2023 |
| (First Best Paper Award) Vacuum Quality Impact on Covalent Bonding K Abadie, Q Lomonaco, L Michaud, F Fournel, C Morales Electrochemical Society Meeting Abstracts 244, 1600-1600, 2023 | | 2023 |
| Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion LG Michaud, F Fournel, C Morales, M Schmidbauer, K Abadie, T Plach, ... ECS Transactions 112 (3), 23, 2023 | | 2023 |
| Vacuum Quality Impact on Covalent Bonding K Abadie, Q Lomonaco, L Michaud, F Fournel, C Morales ECS Transactions 112 (3), 125, 2023 | | 2023 |
| Thin-film transfer method F Fournel, L Michaud, P Montmeat US Patent 11,551,976, 2023 | | 2023 |
| Method of transferring a thin film from a substrate to a flexible support L Michaud, C Castan, F Fournel, P Montmeat US Patent 11,244,971, 2022 | | 2022 |
| Elaboration and transfer of tensile strained thin films L Michaud Université Grenoble Alpes [2020-....], 2021 | | 2021 |
| Elaboration et transfert de films ultra-contraints L Michaud Université Grenoble Alpes, 2021 | | 2021 |
| Highly Strained Silicon on Polymer Obtained By Temporary Polymer Wafer Bonding LG Michaud, C Castan, P Montméat, E Azrak, N Nikitskiy, F Fournel, ... PRiME 2020 (ECS, ECSJ, & KECS Joint Meeting), 2020 | | 2020 |
| PROCEDE DE TRANSFERT DE FILM MINCE F FOURNEL, L MICHAUD, P MONTMEAT FR Patent 3,087,297, 2018 | | 2018 |
