Rack with integrated rear-door heat exchanger A Claassen, EA Eckberg, DJ Hansen, V Kamath, MK Iyengar, ... US Patent 7,660,116, 2010 | 146 | 2010 |
Development of laminar mixed convection flow in a horizontal rectangular duct with uniform bottom heating HV Mahaney, FP Incropera, S Ramadhyani Numerical Heat Transfer, Part A: Applications 12 (2), 137-155, 1987 | 94 | 1987 |
Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger EA Eckberg, V Kamath, HV Mahaney Jr, WM Megarity, ME Steinke US Patent 8,789,384, 2014 | 84 | 2014 |
Comparison of predicted and measured mixed convection heat transfer from an array of discrete sources in a horizontal rectangular channel HV Mahaney, FP Incropera, S Ramadhyani International Journal of Heat and Mass Transfer 33 (6), 1233-1245, 1990 | 67 | 1990 |
Moisture barrier seals for cooled IC chip module assemblies S Kang, HV Mahaney Jr, RR Schmidt, P Singh US Patent 6,125,036, 2000 | 65 | 2000 |
High density heatsink attachment JR Brezina, JS Corbin Jr, HV Mahaney Jr, JR Taylor US Patent 5,808,236, 1998 | 59 | 1998 |
Multi-rack, door-mounted heat exchanger EA Eckberg, DP Graybill, MK Iyengar, HV Mahaney Jr, RR Schmidt, ... US Patent 8,804,334, 2014 | 54 | 2014 |
Dehumidified cooling assembly for IC chip modules S Kang, HV Mahaney Jr, RR Schmidt, P Singh US Patent 6,233,959, 2001 | 51 | 2001 |
Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof WJ Anderl, SM Branch, DP Gaio, MF Hanley, WK Hogan, HV Mahaney Jr US Patent 7,314,318, 2008 | 49 | 2008 |
System for cooling memory modules MK Iyengar, V Kamath, HV Mahaney Jr, JA Matteson, ME Steinke US Patent 7,969,736, 2011 | 47 | 2011 |
Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger DF Champion, EA Eckberg, JD Gerken, HV Mahaney Jr US Patent App. 12/106,710, 2009 | 45 | 2009 |
Container-based data center having greater rack density PA Wormsbecher, GJ McKnight, MS Miller, HV Mahaney US Patent 8,116,080, 2012 | 43 | 2012 |
Numerical simulation of three-dimensional mixed convection heat transfer from an array of discrete heat sources in a horizontal rectangular duct HV Mahaney, S Ramadhyani, FP Incropera Numerical heat transfer 16 (3), 267-286, 1989 | 36 | 1989 |
Multi-rack, door-mounted heat exchanger EA Eckberg, DP Graybill, MK Iyengar, HV Mahaney Jr, RR Schmidt, ... US Patent 9,321,136, 2016 | 35 | 2016 |
Liquid coolant conduit secured in an unused socket for memory module cooling MK Iyengar, V Kamath, HV Mahaney Jr, ME Steinke, A Vallury US Patent 8,385,069, 2013 | 35 | 2013 |
Cooled IC chip modules with an insulated circuit board S Kang, HV Mahaney Jr, RR Schmidt, P Singh US Patent 6,243,268, 2001 | 35 | 2001 |
System, apparatus and method for controlling temperature of an integrated circuit under test DP Beaman, RF Florence Jr, HV Mahaney Jr, FW Wright IV US Patent 7,218,129, 2007 | 33 | 2007 |
Common heatsink for multiple chips and modules MA Gaynes, HV Mahaney Jr, MV Pierson US Patent 6,661,661, 2003 | 31 | 2003 |
Functional and stress testing of LGA devices JS Corbin Jr, JA Garza, DM Kent, KC Larsen, HV Mahaney Jr, HT Phan, ... US Patent 7,453,279, 2008 | 30 | 2008 |
High density heatsink attachment and method therefor JR Brezina, JS Corbin Jr, HV Mahaney Jr, JR Taylor US Patent 6,180,874, 2001 | 30 | 2001 |