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Co-authors
Ling ShiHong Kong University of Science and TechnologyVerified email at ust.hk
Daniel E. QuevedoQueensland University of TechnologyVerified email at qut.edu.au
Subhrakanti DeyProfessor, Hamilton Institute, National Univ of Ireland, Maynooth and Uppsala University, SwedenVerified email at mu.ie
Vincent LAUChair Professor, HKUSTVerified email at ee.ust.hk
Peng ChengProfessor, Zhejiang UniversityVerified email at iipc.zju.edu.cn
JIMING CHENProfessor at Zhejiang UniversityVerified email at ieee.org
Kemi DingResearch Fellow, Nanyang Technological UniversityVerified email at ntu.edu.sg
Junfeng WuZHEJIANG UNIVERSITYVerified email at zju.edu.cn
Dawei ShiBeijing Institute of TechnologyVerified email at bit.edu.cn
Zhengen ZhaoNanjing University of Aeronautics and AstronauticsVerified email at nuaa.edu.cn
ZHANG Fan (Michael)Huawei TechnologiesVerified email at huawei.com
Chung Shue (Calvin) ChenNokia Bell Labs, DMTS, SMIEEEVerified email at nokia-bell-labs.com
Wing Shing WongChinese University of Hong KongVerified email at ie.cuhk.edu.hk
Yuzhe Li
Verified email at mail.neu.edu.cn - Homepage