| Design of an on-silicon-interposer passive equalizer for next generation high bandwidth memory with data rate up to 8 Gb/s Y Jeon, H Kim, J Kim, M Je IEEE Transactions on Circuits and Systems I: Regular Papers 65 (7), 2293-2303, 2018 | 19 | 2018 |
| Design of an on-interposer passive equalizer for high bandwidth memory (HBM) with 30Gbps data transmission Y Jeon, H Kim, S Choi, Y Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2475-2480, 2016 | 16 | 2016 |
| Signal integrity of bump-less high-speed through silicon via channel for terabyte/s bandwidth 2.5 D IC H Lee, H Kim, S Choi, J Lim, K Cho, Y Jeon, J Shim, H Kim, YJ Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2519-2522, 2016 | 16 | 2016 |
| A 100Mb/s galvanically-coupled body-channel-communication transceiver with 4.75 pJ/b TX and 26.8 pJ/b RX for bionic arms Y Jeon, C Jung, SI Cheon, H Cho, JH Suh, H Jeon, ST Koh, M Je 2019 Symposium on VLSI Circuits, C292-C293, 2019 | 13 | 2019 |
| An area-efficient rectifier with threshold voltage cancellation for intra-body power transfer H Cho, JH Suh, H Shin, Y Jeon, C Jung, M Je 2019 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2019 | 13 | 2019 |
| A 3.9 μW, 81.3 dB SNDR, DC-coupled, time-based neural recording IC with degeneration R-DAC for bidirectional neural interface in 180nm CMOS H Jeon, JS Bang, Y Jung, T Lee, Y Jeon, ST Koh, J Choi, D Jang, S Hong, ... 2018 IEEE Asian Solid-State Circuits Conference (A-SSCC), 91-92, 2018 | 8 | 2018 |
| Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission Y Jeon, H Kim, S Choi, J Song, Y Kim, J Kim 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 3 | 2015 |
| Secure and Stable Wireless Communication for an Ingestible Device Y Jeon, S Maji, SY Yang, MSS Thaniana, A Gierlach, I Ballinger, ... IEEE Engineering in Medicine and Biology Society (EMBC), 2023 | 1 | 2023 |
| A 650-uW 30-Mbps Galvanic Coupling Communication Receiver for Bionic Arms Y Jeon, H Jeon, SI Cheon, C Jung, M Je 2018 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2018 | 1 | 2018 |
| A Batteryless Electrochemical Sensing System IC Based on Intra-Body Power and Data Transfer Towards Miniaturized Wearable Sensor Nodes JH Suh, H Cho, Y Jeon, M Je 2023 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2023 | | 2023 |
| Cochlear Implant System Using Body Area Network KS Min, M Je, Y Jeon, H Lee, W Ahn KR Patent KR102353157B1, 2021 | | 2021 |
| Method for data communication and power charging utilizing a human body channel and apparatus for performing the same YW Song, J Kim, H Yi, M Je, JH Suh, Y Jeon KR Patent KR102281442B1, 2021 | | 2021 |
| Method for data communication and power charging using human body channel, and device for performing the same YW Song, JS Kim, H Yi, JE Minkyu, SUH Ji-Hoon, Y Jeon US Patent App. 16/882,337, 2021 | | 2021 |
| Design of a Hybrid Equalizer for 12.8-Gb/s High Bandwidth Memory Gen. 4 Y Jeon, C Jung, BM Moon, M Je DesignCon, 2021 | | 2021 |
| Body channel communication method and appartus performing the same M Je, YJ Jeon, C Jung KR Patent KR102324991B1, 2020 | | 2020 |
| Body channel communication method and apparatus for performing the same C Jung, Y Jeon, M Je US, 2020 | | 2020 |
| Body channel communication method and apparatus for performing the same CJ Minkyu Je, Yeseul Jeon US Patent 11552715B2, 0 | | |
