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Andreas C Fischer
Andreas C Fischer
Ph.D. from KTH Royal Institute of Technology in Stockholm, Sweden
Verified email at ee.kth.se
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Cited by
Cited by
Year
Handbook of silicon based MEMS materials and technologies
M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Krockel, ...
William Andrew, 2015
552*2015
Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
3592013
Integrating MEMS and ICs
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 2015
338*2015
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
2542015
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
1092016
Pressure sensors based on suspended graphene membranes
AD Smith, S Vaziri, F Niklaus, AC Fischer, M Sterner, A Delin, M Östling, ...
Solid-State Electronics 88, 89-94, 2013
822013
Unconventional applications of wire bonding create opportunities for microsystem integration
AC Fischer, JG Korvink, N Roxhed, G Stemme, U Wallrabe, F Niklaus
Journal of Micromechanics and Microengineering 23 (8), 083001, 2013
772013
Graphene-based CO 2 sensing and its cross-sensitivity with humidity
AD Smith, K Elgammal, X Fan, MC Lemme, A Delin, M Råsander, ...
RSC advances 7 (36), 22329-22339, 2017
582017
High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires
AC Fischer, SJ Bleiker, N Somjit, N Roxhed, T Haraldsson, G Stemme, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 541-547, 2012
55*2012
Flexible and stretchable microneedle patches with integrated rigid stainless steel microneedles for transdermal biointerfacing
M Rajabi, N Roxhed, RZ Shafagh, T Haraldson, AC Fischer, W Wijngaart, ...
PloS one 11 (12), e0166330, 2016
532016
High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires
FN Simon J Bleiker, Andreas C Fischer, Umer Shah, Nutapong Somjit, Tommy ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015
46*2015
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus
Journal of Micromechanics and Microengineering 22 (10), 105001, 2012
412012
CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration
FN Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland, Stian Martinsen ...
Selected Topics in Quantum Electronics, IEEE Journal of 21 (4), 1-11, 2015
40*2015
3D Free‐Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching
AC Fischer, LM Belova, YGM Rikers, BG Malm, HH Radamson, ...
Advanced Functional Materials 22 (19), 4004-4008, 2012
312012
Chapter 26: Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS
AC Fischer, M Mäntysalo, F Niklaus, M Tilli, T Motooka, VM Airaksinen, ...
Handbook of Silicon Based MEMS Materials and Technologies (Second Edi􏰀on), 2015
26*2015
Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires
AC Fischer, N Roxhed, T Haraldsson, N Heinig, G Stemme, F Niklaus
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International …, 2011
262011
Low-cost uncooled microbolometers for thermal imaging
N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ...
Proc. SPIE, 772611, 2010
252010
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays
F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ...
Infrared physics & technology 60, 251-259, 2013
222013
Wire-bonded through-silicon vias with low capacitive substrate coupling
AC Fischer, M Grange, N Roxhed, R Weerasekera, D Pamunuwa, ...
Journal of Micromechanics and Microengineering 21, 085035, 2011
212011
SUSPENDED SEDIMENT AND TRANSPORT AT SHELF-BREAK AND ON SLOPE-WILMINGTON-CANYON AREA, EASTERN USA
AK Lyall, DJ Stanley, HN Giles, A Fisher
MARINE TECHNOLOGY SOCIETY JOURNAL 5 (1), 15-&, 1971
201971
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