Aashish Shah, Ph.D.
Aashish Shah, Ph.D.
Senior Staff Engineer, Team Lead for Process and Ultrasonics R&D, Kulicke and Soffa Industries Inc.
Verified email at kns.com - Homepage
Title
Cited by
Cited by
Year
In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
Microelectronic Engineering 85 (9), 1851-1857, 2008
572008
Low-stress thermosonic copper ball bonding
A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon
IEEE transactions on electronics packaging manufacturing 32 (3), 176-184, 2009
452009
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon
Microelectronics Reliability 51 (1), 67-74, 2011
362011
Ultrasonic friction power during Al wire wedge-wedge bonding
A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou
Journal of applied physics 106 (1), 013503, 2009
362009
Role of process parameters on bondability and pad damage indicators in copper ball bonding
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
Microelectronics Reliability 51 (1), 60-66, 2011
292011
The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
H Gaul, A Shah, M Mayer, Y Zhou, M Schneider-Ramelow, H Reichl
Microelectronic Engineering 87 (4), 537-542, 2010
192010
Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor
A Shah, J Lee, M Mayer, YN Zhou
Sensors and Actuators A: Physical 148 (2), 462-471, 2008
182008
Reduction of underpad stress in thermosonic copper ball bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
2008 58th Electronic Components and Technology Conference, 2123-2130, 2008
172008
Method for identifying modulators of NAv ion channels
A Dubin, S Chaplan, S Brown, E Kaftan
US Patent 7,195,879, 2007
172007
Free-air ball formation and deformability with Pd coated Cu wire
A Rezvani, M Mayer, A Shah, N Zhou, SJ Hong, JT Moon
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1516-1522, 2011
162011
Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
A Shah, M Mayer, Y Zhou, J Persic, JT Moon
2009 11th Electronics Packaging Technology Conference, 10-15, 2009
162009
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding
A Rezvani, A Shah, M Mayer, Y Zhou, JT Moon
Microelectronics Reliability 53 (7), 1002-1008, 2013
142013
Effect of process parameters on pad damage during Au and Cu ball bonding processes
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
2009 11th Electronics Packaging Technology Conference, 573-578, 2009
142009
Advances in wire bonding technology for 3D die stacking and fan out wafer level package
I Qin, O Yauw, G Schulze, A Shah, B Chylak, N Wong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1309-1315, 2017
122017
Ultrasonic friction power during thermosonic Au and Cu ball bonding
A Shah, M Mayer, I Qin, C Huynh, Y Zhou, M Meyer
Journal of Physics D: Applied Physics 43 (32), 325301, 2010
112010
Availability analysis of a generalized maintainable three‐state device parallel system with human error and common‐cause failures
BS Dhillon, AS Shah
Journal of quality in maintenance Engineering, 2007
112007
Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding
Y Huang, A Shah, M Mayer, N Zhou, J Persic
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 57 …, 2009
102009
Reliability and availability analysis of three-state device redundant systems with human errors and common-cause failures
ASBS DHILLON
International Journal of Performability Engineering 3 (4), 411-418, 2007
102007
Advances in Wire Bonding Technology for Different Bonding Wire Material
I Qin, A Shah, H Xu, B Chylak, N Wong
International Symposium on Microelectronics 2015 (1), 000406-000412, 2015
72015
Thermosonic Au ball bonding process investigated using microsensor and laser vibrometer
I Qin, A Shah, C Huynh, D DeAngelis, M Meyer, M Mayer, Y Zhou
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
72010
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