David Danovitch
David Danovitch
Professor of Electrical and Computor Engineering, Université de Sherbrooke
Verified email at usherbrooke.ca
Title
Cited by
Cited by
Year
Method for building interconnect structures by injection molded solder and structures built
DG Berger, GP Brouillette, DH Danovitch, PA Gruber, RS Patel, S Roux, ...
US Patent 5,775,569, 1998
1101998
Optoelectronic assembly with alignment member
GR Carden, DH Danovitch, EM Foster, WW Vetter
US Patent 5,202,943, 1993
1101993
Bilayer wafer-level underfill
SL Buchwalter, D Danovitch, FE Doany, C Feger, PA Gruber, R Iyengar, ...
US Patent 6,924,171, 2005
652005
Low-cost wafer bumping
PA Gruber, L Belanger, GP Brouillette, DH Danovitch, JL Landreville, ...
IBM Journal of Research and Development 49 (4.5), 621-639, 2005
652005
Silicon carrier optoelectronic packaging
PS Andry, RA Budd, B Dang, D Danovitch, BV Fasano, P Fortier, L Guerin, ...
US Patent 8,290,008, 2012
502012
Apparatus for transferring solder bumps and method of using
GD Beaumont, GP Brouillette, DH Danovitch, PA Gruber
US Patent 6,003,757, 1999
501999
Pb-free solder alloys for flip chip applications
SK Kang, J Horkans, PC Andricacos, RA Carruthers, J Cotte, M Datta, ...
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat …, 1999
441999
Achieving mechanical and thermal stability in a multi-chip package
JA Casey, JS Corbin Jr, D Danovitch, I Depatie, VR Jadhav, RA Liptak, ...
US Patent 8,202,765, 2012
402012
Injection molded solder technology for Pb-free wafer bumping
PA Gruber, DY Shih, L Belanger, G Brouillette, D Danovitch, V Oberson, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
402004
Low cost bumping process for flip chip
J Audet, L Belanger, G Brouillette, D Danovitch, V Oberson
Proc. 1995 International Flip Chip, BGA, and Ado Pkg. Symposium ITAP 95 (95 …, 1995
401995
nEXO pre-conceptual design report
SA Kharusi, A Alamre, JB Albert, M Alfaris, G Anton, IJ Arnquist, ...
arXiv preprint arXiv:1805.11142, 2018
372018
Direct chip attach for low alpha emission interconnect system
GP Brouillette, DH Danovitch, M Liehr, WT Motsiff, JM Roldan, ...
US Patent 5,897,336, 1999
321999
Low temperature solder column attach by injection molded solder and structure formed
PA Gruber, LR Bolde, GP Brouillette, JH Covell, D Danovitch, CC Lei
US Patent 6,276,596, 2001
302001
Hybrid molds for molten solder screening process
SA Cordes, DH Danovitch, PA Gruber, JL Speidell, JP Zinter
US Patent 6,832,747, 2004
282004
Interconnect for low temperature chip attachment
DG Berger, GP Brouillette, DH Danovitch, PA Gruber, BL Humphrey, ...
US Patent 6,127,735, 2000
272000
Method for forming integrated circuit assembly
B Dang, DH Danovitch, MJ Interrante, JU Knickerbocker, MJ Shapiro
US Patent 8,689,437, 2014
252014
Method for building interconnect structures by injection molded solder and structures built
DG Berger, GP Brouillette, DH Danovitch, PA Gruber, RS Patel, S Roux, ...
US Patent 6,133,633, 2000
252000
Hybrid molds for molten solder screening process
SA Cordes, DH Danovitch, PA Gruber, JL Speidell, JP Zinter
US Patent 6,390,439, 2002
242002
Grounding and thermal dissipation for integrated circuit packages
D Danovitch, E Duchesne
US Patent 6,819,566, 2004
222004
Dual-solder flip-chip solder bump
D Danovitch, S Kilpatrick
US Patent 6,893,799, 2005
202005
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