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Omkar Gupte
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Smooth, All-Solid, Low-Hysteresis, Omniphobic Surfaces with Enhanced Mechanical Durability
M Boban, K Golovin, B Tobelmann, O Gupte, JM Mabry, A Tuteja
ACS applied materials & interfaces 10 (14), 11406-11413, 2018
1002018
Fundamentals of device and systems packaging: technologies and applications
R Tummala
McGraw Hill Professional, 2019
162019
Innovative Socketable and Surface-Mountable BGA Interconnections
O Gupte, K Teoh, R Tummala, G Murtagian, V Smet
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1028-1034, 2019
112019
Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres
O Gupte, G Murtagian, R Tummala, V Smet
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
82020
Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres
O Gupte, G Murtagian, R Tummala, V Smet
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019
82019
Thermal aging reliability of socketable, surface-modified solder BGAs with and without polymer collars
O Gupte, G Murtagian, R Tummala, V Smet
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 512-517, 2020
62020
A Review of Low Temperature Solders in Microelectronics Packaging
V Jayaram, O Gupte, K Bhangaonkar, C Nair
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023
52023
Functionalization of poly (ether sulfone)(PES) and polysulfone (PSF) membrane
V Subramanian, O Gupte
The Bombay Technologist, 22-26, 2014
52014
Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5 D Glass BGA Packages
V Jayaram, O Gupte, V Smet
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1060-1067, 2022
42022
Solder paste wicking in socketable BGAs
O Gupte, V Smet, G Murtagian, R Tummala
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (DPC …, 2019
32019
Solid-state diffusion studies of lead-free solders on gold and in polymer films
O Gupte, G Murtagian, M Kathaperumal, R Tummala, V Smet
Journal of Materials Science: Materials in Electronics 33 (10), 7679-7690, 2022
22022
Effect of latching force on socketed BGA packages with Ni-Au coated solder spheres
O Gupte, G Murtagian, R Tummala, V Smet
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2158-2164, 2021
22021
Modeling, Design and Demonstration of a Single, Innovative Metallurgical System for Socketable and Surface-Mountable Board-Level Interconnections
OD Gupte
Georgia Institute of Technology, 2021
22021
ELECTRONIC DEVICE CARRIER STRUCTURES INCLUDING POLYMER LAYERS AS BARRIERS TO SOLID STATE SOLDER DIFFUSION AND METHODS OF FORMING THE SAME
O Gupte, V Smet, GR Murtagian
US Patent App. 17/664,408, 2022
2022
Investigation of Aromatic Voltage Stabilizers for Enhancing High Voltage Stability of Epoxy for Power Electronics
J Li, K Mohanalingam, O Gupte, Z Sun, K Moon, C Wong
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2348-2354, 2021
2021
Fundamentals of Device and Systems Packaging
RR Tummala
2019
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