| Efficient thermal simulation for 3-D IC with thermal through-silicon vias D Oh, CCP Chen, YH Hu IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012 | 21 | 2012 |
| Runtime temperature-based power estimation for optimizing throughput of thermal-constrained multi-core processors D Oh, NS Kim, CCP Chen, A Davoodi, YH Hu 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 593-599, 2010 | 17 | 2010 |
| 3DFFT: Thermal analysis of non-homogeneous IC using 3D FFT Green function method D Oh, CCP Chen, YH Hu 8th International Symposium on Quality Electronic Design (ISQED'07), 567-572, 2007 | 15 | 2007 |
| The compatibility analysis of thread migration and DVFS in multi-core processor D Oh, CCP Chen, NS Kim, YH Hu 2010 11th International Symposium on Quality Electronic Design (ISQED), 866-871, 2010 | 5 | 2010 |
| METHOD FOR PROVIDING INTERFACE FOR ACQUIRING IMAGE OF SUBJECT, AND ELECTRONIC DEVICE dongkeun oh, kim gil yoon, kim jeong ki kim, kim min jeong, won jong hun KR Patent 1,020,180,093,558, 2018 | | 2018 |
| Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits RO Topaloglu, P Li Bentham Science Publishers, 2011 | | 2011 |
| A Mathematical Method for VLSI Thermal Simulation at the System and Circuit Levels D Oh, CCP Chen, YH Hu Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits, 149, 2011 | | 2011 |
Yu Hen HuProfessor of Electrical and Computer Engineering, University of Wisconsin - MadisonVerified email at wisc.edu
